Efficient algorithm for directed text detection based on rotation decoupled bounding box.

A more effective directed text detection algorithm is proposed for the problem of low accuracy in detecting text with multiple sources, dense distribution, large aspect ratio and arbitrary alignment direction in the industrial intelligence process. The algorithm is based on the YOLOv5 model architecture, inspired by the idea of DenseNet dense connection, a parallel cross-scale feature fusion method is proposed to overcome the problem of blurring the underlying feature semantic information and deep location information caused by the sequential stacking approach and to improve the multiscale feature information extraction capability. Furthermore, a rotational decoupling border detection module, which decouples the rotational bounding box into horizontal bounding box during positive sample matching, is provided, overcoming the angular instability in the process of matching the rotational bounding box with the horizontal anchor to obtain higher-quality regression samples and improve the precision of directed text detection. The MSRA-TD500 and ICDAR2015 datasets are used to evaluate the method, and results show that the algorithm measured precision and F1-score of 89.2% and 88.1% on the MSRA-TD500 dataset, respectively, and accuracy and F1-score of 90.6% and 89.3% on the ICDAR2015 dataset, respectively. The proposed algorithm has better competitive ability than the SOTA text detection algorithm.

Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO2 Abrasives on Sapphire Wafer.

Corrosive and toxic solutions are normally employed to polish sapphire wafers, which easily cause environmental pollution. Applying green polishing techniques to obtain an ultrasmooth sapphire surface that is scratch-free and has low damage at high polishing efficiency is a great challenge. In this paper, novel diamond/SiO2 composite abrasives were successfully synthesized by a simplified sol-gel strategy. The prepared composite abrasives were used in the semi-fixed polishing technology of sapphire wafers, where the polishing slurry contains only deionized water and no other chemicals during the whole polishing process, effectively avoiding environmental pollution. The experimental results showed that diamond/SiO2 composite abrasives exhibited excellent polishing performance, along with a 27.2% decrease in surface roughness, and the material removal rate was increased by more than 8.8% compared with pure diamond. Furthermore, through characterizations of polished sapphire surfaces and wear debris, the chemical action mechanism of composite abrasives was investigated, which confirmed the solid-state reaction between the SiO2 shell and the sapphire surface. Finally, applying the elastic-plastic contact model revealed that the reduction of indentation depth and the synergistic effect of chemical corrosion and mechanical removal are the keys to improving polishing performance.