Lateral GeSn p-i-n photodetectors on insulator prepared by the rapid melting growth method.

In this work, GeSn lateral p-i-n photodetectors (PDs) on insulator were fabricated with an active GeSn layer grown by the rapid melting growth (RMG) method. Taking advantages of the defect-free GeSn strips, GeSn PDs with 5.3% Sn content have low dark current and high responsivities, which are about 0.48, 0.47, and 0.24 A/W for wavelengths of 1550, 1630, and 2000 nm, respectively. The radio frequency of the lateral GeSn PDs was also studied and a 3 dB bandwidth of about 3.8 GHz was achieved. These results indicate that the GeSn grown by the rapid melting growth method is capable of fabricating high-performance Si-based optoelectronic devices.

Sn component gradient GeSn photodetector with 3†dB bandwidth over 50†GHz for extending L band telecommunication.

In this work, high-performance GeSn photodetectors with a Sn content gradient GeSn layer were fabricated on SOI substrate by CMOS-compatible process for C and L band telecommunication. The active GeSn layer has a Sn component increased from 9 to 10.7% with the controlled relaxation degree up to 84%. The responsivities of GeSn detectors at 1550 nm and 1630 nm are 0.47 A/W and 0.32 A/W under -4 V bias, respectively. Over 50 GHz 3 dB bandwidth with the eye pattern about 70 Gb/s was also evidenced at 1630 nm. These results indicate that the GeSn photodetectors have a promising application for extending the silicon photonics from C band to L band.

Modeling, analysis, and demonstration of a carrier-injection electro-absorption modulator at 2 µm on Ge-on-Si platform.

In this paper, a carrier-injection electro-absorption modulator (EAM) at 2 µm is demonstrated on Ge-on-Si platform. The EAM shows a compact size and high modulation efficiency due to the strong free-carrier electroabsorption (FCEA) effect in Ge. A modulation depth of 40 dB can be obtained under the injection current of only 420 mA. Small-signal frequency response measurement is performed and a small-signal equivalent circuit model is proposed. Based on reflection coefficients and equivalent circuit, the frequency response of carrier-injection EAM is discussed in detail. The 500 Mbps open eye diagram verifies the data-processing capacity of our EAM at 2 µm wavelength for its application in biological, chemical molecular detection, and infrared imaging systems.

High-speed and high-power germanium photodetector based on a trapezoidal absorber.

A compact high-power germanium photodetector (Ge PD) is experimentally demonstrated by re-engineering light distribution in the absorber. Compared with a conventional Ge PD, the proposed structure shows a DC saturation photocurrent improved by 28.9% and 3 dB bandwidth as high as 49.5 GHz at 0.1 mA. Under the same photocurrent of 10.5 mA, the proposed Ge PD shows a 3 dB bandwidth of 11.1 GHz, which is almost double the conventional Ge PD (5.6 GHz). The 25 Gb/s eye-diagram measurement verifies the improved power handling capability. The compact size and manufacturing simplicity of this structure will enable new applications for integrated silicon photonics.

GeSn resonance cavity enhanced photodetector with gold bottom reflector for the L band optical communication.

In this work, GeSn resonant cavity enhanced (RCE) p-i-n photodetectors (PDs) with 3.7% Sn content in a GeSn layer were fabricated on a silicon on insulator (SOI) substrate. The gold (Au) layer and the deposited SiO2 layer constitute the bottom reflector and top reflector of the RCE detectors, respectively. The GeSn RCE PD has three resonant peaks and its responsivity is improved about 4.5 times at 1630 nm, compared with GeSn PDs without a gold bottom mirror. The cutoff wavelength of GeSn RCE PDs is up to 1820 nm, while it is only 1730 nm for GeSn PDs without a gold reflector. The responsivity of RCE PDs at 1630 nm reaches 0.126 A/W and 3-dB bandwidth at about 36 GHz is achieved. These results indicate that the RCE structure is an effective approach for enhancing the GeSn PD performance operated at the L band.

High-performance waveguide-coupled lateral Ge/Si avalanche photodetector.

A high-performance waveguide-coupled lateral avalanche photodetector (APD) is experimentally demonstrated without silicon epitaxy and charge layer ion implantation. At the wavelength of 1550 nm, it shows a high responsivity of 48 A/W and a gain-bandwidth product (GBP) of 360 GHz. Wide-open eye diagrams at 25 Gbps can be observed at various avalanche gains. These outstanding performances indicate the proposed APD has great potential in high-speed optical transceivers for optical links.

High-power back-to-back dual-absorption germanium photodetector.

A high-power germanium photodetector is designed and fabricated using a cold-wall ultrahigh vacuum chemical vapor deposition. A back-to-back dual-absorption structure improves high-power characteristics by reducing the space-charge effect. Compared to a typical p-i-n photodetector, the saturated photocurrent of the back-to-back dual-absorption photodetector is improved from 16.2 to 21.3 mA at $ - {3}\;{\rm V}$-3V. At a bias voltage of $ - {1}\;{\rm V}$-1V, the dark current is 1.31 µA. The optical responsivities are 0.31 and 0.52 A/W at 1550 and 1310 nm, respectively. The 3 dB bandwidth of 4.14 GHz is achieved at $ - {3}\;{\rm V}$-3V. Theoretically, the 3 dB bandwidth can be further optimized in future device fabrication.

Study of GePb photodetectors for shortwave infrared detection.

Ge0.998Pb0.002 photodetectors (PDs) with a GePb layer grown on n-type Ge (100) substrate by magnetron sputtering epitaxy were fabricated by complementary metal-oxide semiconductor (CMOS)-compatible technology. For Ge0.998Pb0.002 PDs, the room-temperature dark current density at -1 V was 3.3 A/cm2. At room temperature, the GePb PDs demonstrated a longwave cutoff of 2.5 µm and the optical responsivities of GePb PDs ranging from 1500 nm to 2000 nm were measured. A temperature dependence optical characterization of these detectors was conducted and temperature-dependent energy bandgaps of Ge0.998Pb0.002 were derived from the photocurrent spectra.

Multilayer Graphene-GeSn Quantum Well Heterostructure SWIR Light Source.

The problem of light source always prevents silicon-based photonics from achieving a final integration. Although some optical pump lasers have been reported in recent years, an electrical pumping laser is considered as the ultimate solution. To fabricate a Si-based laser, there are some crucial obstacles that need to be solved such as difficulties in material epitaxy, light absorption by metal electrodes, and compatibility with the existing complementary metal-oxide-semiconductor transistor process. Here, a multilayer graphene and GeSn/Ge quantum well (QW) heterostructure is designed and fabricated as a Si-based light source. Specially designed Ge0.9 Sn0.1 /Ge QWs are used as active layer, which achieves a photoluminescence (PL) peak at 2050 nm. Graphene, which has a high transmittance for all bands of light, lessens the burden of growing thick cladding layer and perfectly breaks the deadlock of light disappearance in metal contacts. The electroluminescence (EL) spectrum of the device is achieved at a peak of 2100 nm under an injection current density of 100 A cm-2 . Both the PL and EL measurements show the heterostructure has good performance as a short-wave infrared (SWIR) light source. Therefore, the results provides a good alternative for the light source in silicon-based photonics.

Theoretical study of the bandgap regulation of a two-dimensional GeSn alloy under biaxial strain and uniaxial strain along the armchair direction.

Recently, two-dimensional germanium-tin (2D-GeSn) alloys have attracted considerable attention because they have been predicted to possess a direct bandgap, and this bandgap can be tuned by changing the Sn concentration. However, the tuning efficiency of alloying Sn is still relatively low, and alloying more Sn in 2D-GeSn is difficult to accomplish. To address this issue, the band structures for 2D-GeSn under different strain types (including biaxial and uniaxial strain along the armchair direction, as well as compressive and tensile strain) are investigated using a first-principles method based on density functional theory combined with a GGA+U method and special quasirandom structures. For tensile strain, the results indicate that both biaxially and uniaxially strained 2D-GeSn alloys exhibit direct bandgaps, and their bandgaps decrease as the strain strength increases. The bandgap tuning efficiency for biaxial strain is higher than that for uniaxial strain. For compressive strain, both biaxially and uniaxially strained 2D-GeSn alloys exhibit a large indirect bandgap area, and their bandgaps increase as the strain strength increases; however, their distribution shapes are slightly different. To uncover the physical origin of the difference between them, the projected band, the projected density of the states, the bond length and the bond angle for 2D-GeSn are analyzed. Overall, these results indicate that the combination of alloying Sn and applying an external strain is a good way to reduce the necessary Sn concentration, and this may provide comprehensive theoretical guidance for the strain energy band engineering of 2D-GeSn.

Characterization of a Ge1-x-ySiySnx/Ge1-xSnx multiple quantum well structure grown by sputtering epitaxy.

A high-quality Ge0.88Si0.08Sn0.04/Ge0.94Sn0.06 multiple quantum well (MQW) structure was grown on a Ge (001) substrate by sputtering epitaxy. The MQW structure was characterized by high-resolution x-ray diffraction and transmission electron microscopy. Surface-illuminated Ge0.88Si0.08Sn0.04/Ge0.94Sn0.06 MQW pin photodetectors were fabricated with cutoff wavelengths of up to 2140 nm. The analysis of transitions from spectral response was fitted well with the theoretical calculations. Results suggest that sputtering epitaxy is a promising method for preparing high-quality low-dimensional Sn-based group IV materials and that Ge1-x-ySiySnx/Ge1-xSnx MQWs have potential applications in the development of efficient Si-based photonic devices.

Theoretical study of the effect of different n-doping elements on band structure and optical gain of GeSn alloys.

N-Doping is an effective approach for improving the lighting efficiency of GeSn alloys. As each doping element has an atomic radius and electronegativity value different from those of the host atoms, the shape of the GeSn band is affected. However, no recent studies considering this phenomenon have been reported. For this reason, first-principles calculations combined with the GGA+U method and supercell models have been employed to precisely investigate the structural properties, band structures, and optical gains of Ge0.9375Sn0.0625 when doped with different V-group elements (including P, As, Sb, and Bi). With regard to the structural properties, the results indicate that they all exhibit a positive deviation from Vegard's law; Ge0.9375-mSn0.0625Pm has the largest bowing coefficient. The bandgap results indicate that doping with P and As does not assist in converting GeSn into a direct bandgap material, while doping with Sb and Bi has positive effects on the transition of GeSn; the corresponding crossover values are 1.89 and 1.58%, respectively. The calculated optical gain indicates that the net gain of Ge0.9375-mSn0.0625 will reach a maximum when the injected carrier density is ∼1 × 1019 cm-3, and it will increase as the doping concentration increases. The effects of the doping elements on the optical gain of GeSn can be ranked as Bi > Sb > As > P.

Compact two-mode (de)multiplexer based on symmetric Y-junction and multimode interference waveguides.

A compact two-mode (de)multiplexer [(DE)MUX] based on symmetric Y-junction and multimode interference (MMI) waveguides was designed by 3D beam propagation method (BPM). The phase evolution in the structure was discussed in detail. Simulations show that the optical bandwidth is as large as 100 nm (1500 nm ~1600 nm). The two-mode (DE)MUX is very compact compared with the other kind of mode (DE)MUX. The length of the structure is only 48.8 µm. Simulation also shows the fabrication tolerance is as large as ± 75 nm.

GeSi modulator based on two-mode interference.

A GeSi modulator based on two-mode interference is designed in this study. A GeSi layer with a height of 0.22 µm is introduced to decrease the optical power overlap of the two modes. A doping region in which the free carrier plasma dispersion effect exists to change the oscillation period for on- and off-state switching is identified. A doping concentration of 1×10¹8 cm⁻³ for both n and p type is selected. The single modulation arm for 3 V operation is 1416.3 µm long. The extinction ratio and insertion loss are 15 and 5 dB, respectively. The traveling electrode design shows 3 dB bandwidth as large as 50 GHz.

Harnessing microcomb-based parallel chaos for random number generation and optical decision making.

Optical chaos is vital for various applications such as private communication, encryption, anti-interference sensing, and reinforcement learning. Chaotic microcombs have emerged as promising sources for generating massive optical chaos. However, their inter-channel correlation behavior remains elusive, limiting their potential for on-chip parallel chaotic systems with high throughput. In this study, we present massively parallel chaos based on chaotic microcombs and high-nonlinearity AlGaAsOI platforms. We demonstrate the feasibility of generating parallel chaotic signals with inter-channel correlation <0.04 and a high random number generation rate of 3.84 Tbps. We further show the application of our approach by demonstrating a 15-channel integrated random bit generator with a 20 Gbps channel rate using silicon photonic chips. Additionally, we achieved a scalable decision-making accelerator for up to 256-armed bandit problems. Our work opens new possibilities for chaos-based information processing systems using integrated photonics, and potentially can revolutionize the current architecture of communication, sensing and computations.

Enhanced photoluminescence and electroluminescence of multilayer GeSi islands on Si001 substrates by phosphorus-doping.

Ge/Si heterojunction light emitting diodes with 20-bilayers undoped or phosphorus in situ doped GeSi islands were fabricated on n(+)(-)Si(001) substrates by ultrahigh vacuum chemical vapor deposition (UHV-CVD). Enhanced room temperature photoluminescence (PL) and electroluminescence (EL) around 1.5 µm were observed from the devices with phosphorus-doped GeSi islands. Theoretical calculations indicated that the emission is from the radiative recombination in GeSi islands. The intensity enhancement of PL and EL is attributed to the sufficient supply of electrons in active layer for radiative recombination.

GeSn p-i-n photodetector for all telecommunication bands detection.

Using a 820 nm-thick high-quality Ge0.97Sn0.03 alloy film grown on Si(001) by molecular beam epitaxy, GeSn p-i-n photodectectors have been fabricated. The detectors have relatively high responsivities, such as 0.52 A/W, 0.23 A/W, and 0.12 A/W at 1310 nm, 1540 nm, and 1640 nm, respectively, under a 1 V reverse bias. With a broad detection spectrum (800-1800 nm) covering the whole telecommunication windows and compatibility with conventional complementary metal-oxide-semiconductors (CMOS) technology, the GeSn devices are attractive for applications in both optical communications and optical interconnects.

Fabrication of silicon-based template-assisted nanoelectrode arrays and ohmic contact properties investigation.

A convenient fabrication technology for large-area, highly-ordered nanoelectrode arrays on silicon substrate has been described here, using porous anodic alumina (PAA) as a template. The ultrathin PAA membranes were anodic oxidized utilizing a two-step anodization method, from Al film evaporated on substrate. The purposes for the use of two-step anodization were, first, improving the regularity of the porous structures, and second reducing the thickness of the membranes to 100-200 nm we desired. Then the nanoelectrode arrays were obtained by electroless depositing Ni-W alloy into the through pores of PAA membranes, making the alloy isolated by the insulating pore walls and contacting with the silicon substrates at the bottoms of pores. The Ni-W alloy was also electroless deposited at the back surface of silicon to form back electrode. Then ohmic contact properties between silicon and Ni-W alloy were investigated after rapid thermal annealing. Scanning electron microscopy (SEM) observations showed the structure characteristics, and the influence factors of fabrication effect were discussed. The current-voltage (I-V) curves revealed the contact properties. After annealing in N2 at 700 degrees C, good linear property was shown with contact resistance of 33 omega, which confirmed ohmic contacts between silicon and electrodes. These results presented significant application potential of this technology in nanosize current-injection devices in optoelectronics, microelectronics and bio-medical fields.

Spontaneously Conversion from Film to High Crystalline Quality Stripe during Molecular Beam Epitaxy for High Sn Content GeSn.

Two series of Ge0.8Sn0.2 samples were grown on Ge buffered Si substrate by molecular beam epitaxy (MBE) to investigate the influence of growth temperature and film thickness towards the evolution of surface morphology. A novel phenomena was observed that the Ge0.8Sn0.2 film was segregated and relaxed by the formation of GeSn stripes on the film. Under specific growth condition, the stripes can cover nearly the whole surface. XRD, TEM, AFM, PL and TEM results indicated that the stripes are high quality single crystalline GeSn with Sn content around 5%. The formation of GeSn stripes proposes an effective strategy to fabricate high crystalline quality GeSn stripe on Si, where the Ge0.8Sn0.2 film serves as precursor and the segregated Sn works as catalyst droplets. This technique has great potential for future optoelectronic and microelectronic applications.

Theoretical Analysis of InGaAs/InAlAs Single-Photon Avalanche Photodiodes.

Theoretical analysis and two-dimensional simulation of InGaAs/InAlAs avalanche photodiodes (APDs) and single-photon APDs (SPADs) are reported. The electric-field distribution and tunneling effect of InGaAs/InAlAs APDs and SPADs are studied. When the InGaAs/InAlAs SPADs are operated under the Geiger mode, the electric field increases linearly in the absorption layer and deviate down from its linear relations in the multiplication layer. Considering the tunneling threshold electric field in multiplication layer, the thickness of the multiplication layer should be larger than 300 nm. Moreover, SPADs can work under a large bias voltage to avoid tunneling in absorption layer with high doping concentrations in the charge layer.