Room-Temperature High-Detectivity Flexible Near-Infrared Photodetectors with Chalcogenide Silver Telluride Nanoparticles.

Herein, flexible near-infrared (NIR) photodetectors were prepared using silver telluride (Ag5Te3) nanoparticles (NPs) for optoelectronic applications. For the main channel materials of the photodetectors, Ag5Te3 NPs were used, which were synthesized in an aqueous solution. Moreover, Ag5Te3 thin films were successfully fabricated on plastic substrates at 150 °C using redistributed Ag5Te3 NPs in aqueous inks. The crystal structure, chemistry, and optoelectronic properties of the synthesized photodetectors were studied. The fabricated flexible Ag5Te3-based photodetectors achieved a detectivity of 6.27 × 109 cm Hz1/2 W-1 (>109) at room temperature under ∼0.35% compressive and tensile strains. The obtained detectivity value exceeds those of two-dimensional inorganic layered material phototransistors-such as MoS2-or commercial thermistor bolometers at room temperature (∼109). Furthermore, the proposed novel method for the synthesis of Ag5Te3 thin films on plastic substrates can be applied to other Ag5Te3-based applications in the future.

Improved Environment Stability of Y2O3 RRAM Devices with Au Passivated Ag Top Electrodes.

In this study, we fabricated sol-gel-processed Y2O3-based resistive random-access memory (RRAM) devices. The fabricated Y2O3 RRAM devices exhibited conventional bipolar RRAM device characteristics and did not require the forming process. The long-term stability of the RRAM devices was investigated. The Y2O3 RRAM devices with a 20 nm thick Ag top electrode showed an increase in the low resistance state (LRS) and high resistance state (HRS) and a decrease in the HRS/LRS ratio after 30 days owing to oxidation and corrosion of the Ag electrodes. However, Y2O3 RRAM devices with inert Au-passivated Ag electrodes showed a constant RRAM device performance after 30 days. The 150 nm-thick Au passivation layer successfully suppressed the oxidation and corrosion of the Ag electrode by minimizing the chance of contact between water or oxygen molecules and Ag electrodes. The Au/Ag/Y2O3/ITO RRAM devices exhibited more than 300 switching cycles with a decent resistive window (>103). They maintained constant LRS and HRS resistances for up to 104 s, without significant degradation of nonvolatile memory properties for 30 days while stored in air.

Environmentally and Electrically Stable Sol-Gel-Deposited SnO2 Thin-Film Transistors with Controlled Passivation Layer Diffusion Penetration Depth That Minimizes Mobility Degradation.

This study examines the effect of the annealing time of the Y2O3 passivation layer on the electrical performances and bias stabilities of sol-gel-deposited SnO2 thin-film transistors (TFTs). The environmental stabilities of SnO2 TFTs were examined. After optimizing the Y2O3 passivation layers in SnO2 TFTs, the field-effect mobility was 7.59 cm2/V•s, the VTH was 9.16 V, the subthreshold swing (SS) was 0.88 V/decade, and the on/off-current ratio was approximately 1 × 108. VTH shifts were only -0.18 and +0.06 V under negative and positive bias stresses, respectively. The SnO2 channel layer thickness and oxygen-vacancy concentration in SnO2, which determine the carrier concentration, were successfully tuned by controlling the annealing time of the Y2O3 passivation layers. An extremely thin Y2O3 passivation layer effectively blocked external molecules, thus affecting the device performance. The electrical performance was maximized in SnO2 TFTs using a 15 min-annealed Y2O3 passivation layer. In this TFT, the field-effect mobility was maximally retained and the bias and environmental stabilities were sustained over 90 days of air exposure.

Flexible Sol-Gel-Processed Y2O3 RRAM Devices Obtained via UV/Ozone-Assisted Photochemical Annealing Process.

Flexible indium tin oxide (ITO)/Y2O3/Ag resistive random access memory (RRAM) devices were successfully fabricated using a thermal-energy-free ultraviolet (UV)/ozone-assisted photochemical annealing process. Using the UV/ozone-assisted photochemical process, the organic residue can be eliminated, and thinner and smother Y2O3 films than those formed using other methods can be fabricated. The flexible UV/ozone-assisted photochemical annealing process-based ITO/Y2O3/Ag RRAM devices exhibited the properties of conventional bipolar RRAM without any forming process. Furthermore, the pure and amorphous-phase Y2O3 films formed via this process showed a decreased leakage current and an increased high-resistance status (HRS) compared with the films formed using other methods. Therefore, RRAM devices can be realized on plastic substrates using a thermal-energy-free UV/ozone-assisted photochemical annealing process. The fabricated devices exhibited a resistive window (ratio of HRS/low-resistance status (LRS)) of >104, with the HRS and LRS values remaining almost the same (i.e., limited deterioration occurred) for 104 s and up to 102 programming/erasing operation cycles.

Enhanced Switching Reliability of Sol-Gel-Processed Y2O3 RRAM Devices Based on Y2O3 Surface Roughness-Induced Local Electric Field.

Sol-gel-processed Y2O3 films were used as active channel layers for resistive random access memory (RRAM) devices. The fabricated ITO/Y2O3/Ag RRAM devices exhibited the properties of conventional bipolar memory devices. A triethylamine stabilizer with a high vapor pressure and low surface tension was added to realize the local electric field area. During drying and high-temperature post-annealing processes, the large convective flow enhanced the surface elevation, and the increased -OH groups accelerated the hydrolysis reaction and aggregation. These phenomena afforded Y2O3 films with an uneven surface morphology and an increased surface roughness. The increased roughness of the Y2O3 films attributable to the triethylamine stabilizer enhanced the local electrical field, improved device reliability, and achieved successful repetition of the switching properties over an extended period.