Suspended 3D metallic dimers with sub-10 nm gap for high-sensitive SERS detection.

The suspended metallic nanostructures with tiny gaps have certain advantages in surface-enhanced Raman scattering (SERS) due to the coaction of the tiny metallic nanogaps and the substrate-decoupled electromagnetism resonant modes. In this study, we used the lithographic HSQ/PMMA electron-beam bilayer resist exposure combined with a deposition-induced nanogap-narrowing process to define elevated suspended metallic nanodimers with tiny gaps for surface-enhanced Raman spectroscopy detection. By adjusting the deposited metal thickness, the metallic dimers with sub-10 nm gaps can be reliably obtained. These dimers with tunable nanogaps successfully served as excellent SERS substrates, exhibiting remarkable high-sensitivity detection ability for crystal violet molecules. Systematic experiments and simulations were conducted to explain the origin of the improved SERS performance. The results showed that the 3D elevated suspended metallic dimers could achieve a higher SERS enhancement factor than the metallic dimers on HSQ pillars and a common Si substrate, demonstrating that this kind of suspended metallic dimer is a promising route for high-sensitive SERS detection and other plasmonic applications.

Fabrication of single-nanometer metallic gaps via spontaneous nanoscale dewetting.

Ultrasmall metallic nanogaps are of great significance for wide applications in various nanodevices. However, it is challenging to fabricate ultrasmall metallic nanogaps by using common lithographic methods due to the limited resolution. In this work, we establish an effective approach for successful formation of ultrasmall metallic nanogaps based on the spontaneous nanoscale dewetting effect during metal deposition. By varying the initial opening size of the exposed resist template, the influence of dewetting behavior could be adjusted and tiny metallic nanogaps can be obtained. We demonstrate that this method is effective to fabricate diverse sub-10 nm gaps in silver nanostructures. Based on this fabrication concept, even sub-5 nm metallic gaps were obtained. SERS measurements were performed to show the molecular detection capability of the fabricated Ag nanogaps. This approach is a promising candidate for sub-10 nm metallic gaps fabrication, thus possessing potential applications in nanoelectronics, nanoplasmonics, and nano-optoelectronics.

Wafer-Level Highly Dense Metallic Nanopillar-Enabled High-Performance SERS Substrates for Molecular Detection.

Seeking sensitive, large-scale, and low-cost substrates is highly important for practical applications of surface-enhanced Raman scattering (SERS) technology. Noble metallic plasmonic nanostructures with dense hot spots are considered an effective construction to enable sensitive, uniform, and stable SERS performance and thus have attracted wide attention in recent years. In this work, we reported a simple fabrication method to achieve wafer-scale ultradense tilted and staggered plasmonic metallic nanopillars filled with numerous nanogaps (hot spots). By adjusting the etching time of the PMMA (polymethyl methacrylate) layer, the optimal SERS substrate with the densest metallic nanopillars was obtained, which possessed a detection limit down to 10-13 M by using crystal violet as the detected molecules and exhibited excellent reproducibility and long-term stability. Furthermore, the proposed fabrication approach was further used to prepare flexible substrates; for example, a SERS flexible substrate was proven to be an ideal platform for analyzing low-concentration pesticide residues on curved fruit surfaces with significantly enhanced sensitivity. This type of SERS substrate possesses potential in real-life applications as low-cost and high-performance sensors.

Programmable Nanoscale Crack Lithography for Multiscale PMMA Patterns.

Crack lithography is important for preparing microstructured materials. This strategic use of cracking breaks with the traditional idea that cracks are unwanted and has great potential for high-resolution and high-throughput production. However, the ability to control nanoscale crack patterning is still insufficient. Here, we present a nanoscale, programmable angle-dependent technique to control crack generation that relies on standard electron-beam lithography. Multiscale patterns of poly(methyl methacrylate) of arbitrary shape, geometric size, and large area were obtained, greatly expanding the processing capacity of electron-beam lithography. In addition, we observed the interaction between adjacent structures and cracks, which resulted in crack suppression or second-order cracks. We also demonstrated that angle-dependent nanoscale cracks can be used in physical unclonable functions and have great application prospects in the field of information security. We believe that our strategy for programmable nanoscale crack patterning provides new opportunities and perspectives for nanofabrication.

Dry-Transferable Photoresist Enabled Reliable Conformal Patterning for Ultrathin Flexible Electronics.

Photolithographic techniques, which are widely used in the silicon-based semiconductor industry, enable the manufacture of high-yield and high-resolution features at the micrometer and nanometer scales. However, conventional photolithographic processes cannot accommodate the micro/nanofabrication of flexible and stretchable electronics. In this study, a microfabrication approach that uses a synthesized, environmentally friendly, and dry-transferable photoresist to enable the reliable conformal manufacturing of thin-film electronics is reported, which is also compatible with the existing cleanroom processes. Photoresists with high-resolution, high-density, and multiscale patterns can be transferred onto various substrates in a defect-free and conformal-contact manner, thus enabling multiple wafer reuses. Theoretical studies are conducted to investigate the damage-free peel-off mechanism of the proposed approach. The in situ fabrication of various electrical components, including ultralight and ultrathin biopotential electrodes, has been demonstrated, which offer lower interfacial impedance, durability, and stability, and the components are applied to collect electromyography signals with superior signal-to-noise ratio (SNR) and quality. Additionally, an exemplary demonstration of a human-machine interface indicates the potential of these electrodes in many emerging applications, including healthcare, sensing, and artificial intelligence.

Asymmetric Nanofractures Determined the Nonreciprocal Peeling for Self-Aligned Heterostructure Nanogaps and Devices.

Planar heterostructures composed of two or more adjacent structures with different materials are a kind of building blocks for various applications in surface plasmon resonance sensors, rectifiers, photovoltaic devices, and ambipolar devices, but their reliable fabrication with controllable shape, size, and positioning accuracy remains challenging. In this work, we propose a concept for fabricating planar heterostructures via directional stripping and controlled nanofractures of metallic films, with which self-aligned, multimaterial, multiscale heterostructures with arbitrary geometries and sub-20 nm gaps can be obtained. By using a split ring as the template, the asymmetric nanofracture of the deposited film at the split position results in nonreciprocal peeling of the film in the split ring. Compared to the conventional processes, the final heterostructures are defined only by their outlines, thus providing the ability to fabricate complex heterostructures with higher resolutions. We demonstrate that this method can be used to fabricate heterodimers, multimaterial oligomers, and multiscale asymmetrical electrodes. An Ag-MoS2-Au photodiode with a strong rectification effect is fabricated based on the nanogap heterostructures prepared by this method. This technology provides a unique and reliable approach to define nanogap heterostructures, which are supposed to have potential applications in nanoelectronics, nanoplasmonics, nano-optoelectronics, and electrochemistry.

Development of a symmetrical micro-beam minimizing horizontal drift for indentation and scratch.

In this work, a symmetric micro-beam was developed to eliminate horizontal drift of the tip during indent and scratch processes, which was inevitable in the usage of a traditionally one-end-fixed cantilever. Using the finite element simulation, a database involving the maximum stress and spring constant depending on the size parameters (length and inertial moment) of the symmetric beam was established to help in optimizing the beam design. A real symmetric micro-beam was fabricated based on the database, and the loading accuracy was checked through the calibration of the spring constant. The reliability of the symmetric beam was experimentally verified through the fabrication of the micro-channel and micro-dot, showing that the horizontal drift was completely suppressed. This technology can potentially be applied in micro/nanoscale research and manufacturing to increase the accuracy of detection and processing, such as the applications in probe-based lithography to improve the loading accuracy at high load condition and enhance the stability of the beam system at high sliding speed.