Focal plane coincidence method for a multi-view telecentric 3D imaging system.

Multi-view microscopic fringe projection systems, which use high-resolution telecentric lenses and the Scheimpflug condition, face challenges in coinciding focal planes accurately, resulting in inconsistent measurements between views. In this Letter, we developed a sharpness evaluation function based on the total power of the line-spread function, which was subsequently used to generate a full-field sharpness distribution map. Then we employed the correlation between the sharpness map and orientation of the focal plane to precisely coincide the focal planes. Experimental results validate the proposed method and demonstrate its improved consistency in 3D reconstruction.

Anti-crosstalk absolute phase retrieval method for microscopic fringe projection profilometry using temporal frequency-division multiplexing.

In microscopic fringe projection profilometry (MFPP), the traditional absolute phase retrieval method using composite frequency fringe has the shortcomings of low accuracy and poor robustness due to mutual crosstalk of harmonic from the different channels of frequency-division multiplexing. In this study, an absolute phase retrieval method that avoids the inter-channel crosstalk is proposed. By introducing guard bands to accommodate the frequency channels corresponding to the second harmonic that dominate the high order harmonics, the aliasing between the second harmonic and the fundamental is eliminated. Consequently, phase maps without crosstalk can be demodulated using appropriate phase-shifting algorithms. The proposed method is well-suited for high-precision three-dimensional shape measurement scenarios in many fields such as integrated circuit manufacturing process control and micro-electro-mechanical system quality inspection. The experiment results demonstrate that the anti-crosstalk method is effective and can realize three-dimensional reconstruction for discontinuous planar surface and spherical surface.

Height measurement of microbumps using a white-light triangulation method.

As the electronic interconnection between chips, microbumps are crucial components in advanced packaging for the demand of better performance and higher packaging density. The height and coplanarity of microbumps are critical to ensure the reliability of connections. The poor uniformity in bump height will lead to disconnect or insufficient contact, which will directly result in the failure of the chip's function and a lower yield rate. In this paper, we proposed a height measurement method of microbumps using white-light triangulation combined with geometrical characteristics of bumps. A linear light projection module composed of a lens group and LED light source was set up as well as a high-quality imaging module consisting of a CCD camera and microscope objective group. The projection and imaging model of microbumps illuminated by the light plane at different positions during the scanning process was analyzed. The microbump height is computed from a simple formula based on the geometry of the specimen and the system configuration. The measurement results are compared with that obtained from a commercial optical profiler, and the measurement uncertainty is analyzed in detail.