Fiber array to chip attach using laser fusion splicing for low loss.

With the ever-increasing need for higher data rates, datacom and telecom industries are now migrating to silicon photonics to achieve higher data rates with reduced manufacturing costs. However, the optical packaging of integrated photonic devices with multiple I/O ports remains a slow and expensive process. We introduce an optical packaging technique to attach fiber arrays to a photonic chip in a single shot using CO2 laser fusion splicing. We show a minimum coupling loss of 1.1 dB, 1.5 dB, and 1.4 dB per-facet for 2, 4, and 8-fiber arrays (respectively) fused to the oxide mode converters using a single shot from the CO2 laser.

Enhanced on-chip phase measurement by inverse weak value amplification.

Optical interferometry plays an essential role in precision metrology such as in gravitational wave detection, gyroscopes, and environmental sensing. Weak value amplification enables reaching the shot-noise-limit of sensitivity, which is difficult for most optical sensors, by amplifying the interferometric signal without amplifying certain technical noises. We implement a generalized form of weak value amplification on an integrated photonic platform with a multi-mode interferometer. Our results pave the way for a more sensitive, robust, and compact platform for measuring phase, which can be adapted to fields such as coherent communications and the quantum domain. In this work, we show a 7 dB signal enhancement in our weak value device over a standard Mach-Zehnder interferometer with equal detected optical power, as well as frequency measurements with 2 kHz sensitivity by adding a ring resonator.