Dimensionality reduction induced synergetic optimization of the thermoelectric properties in Bi2Si2X6 (X = Se, Te) monolayers.

Different from three-dimensional bulk compounds, two-dimensional monolayer compounds exhibit much better thermoelectric performance on account of the quantum confinement and interface effect. Here, we present a systematic study on the electronic and thermal transport properties of bulk and monolayer Bi2Si2X6 (X = Se, Te) through theoretical calculations using density functional theory based on first-principles and Boltzmann transport theory. Monolayer Bi2Si2X6 are chemically, mechanically and thermodynamically stable semiconductors with suitable band gaps, and they have lower lattice thermal conductivity (κL) in the a/b direction than their bulk counterparts. The calculated κL of monolayer Bi2Si2Se6 (Bi2Si2Te6) is as low as 0.72 (0.95) W m-1 K-1 at 700 K. Moreover, monolayer Bi2Si2X6 exhibit a higher Seebeck coefficient compared with bulk Bi2Si2X6 owing to the sharper peaks in the electronic density of states (DOS). This results in a significant increase in power factor by dimensionality reduction. Combined with the synergetically suppressed thermal conductivity, the maximum ZT values for monolayer Bi2Si2Se6 and Bi2Si2Te6 are significantly enhanced up to 5.03 and 2.87 with p-type doping at 700 K, which are more than 2 times that of the corresponding bulk compounds. These results demonstrate the superb thermoelectric performance of monolayer Bi2Si2X6 for promising thermoelectric conversion applications.

ß-Ga2O3: a potential high-temperature thermoelectric material.

The thermoelectric properties of intrinsic n-type ß-Ga2O3 are evaluated by first-principles calculations combined with Boltzmann transport theory and relaxation time approximation. The electron mobility is predicted by considering polar optical phonon scattering in ß-Ga2O3. A temperature power law of T-0.67 is obtained for the intrinsic electron mobility. Due to the ultra-wide band gap of 4.7-4.9 eV, ß-Ga2O3 has a large Seebeck coefficient. As a result, a maximum power factor of 3.1 × 10-3 W m-1 K-2 is obtained at 1600 K. A clear anisotropy in lattice thermal conductivity is observed, with the highest thermal conductivity of 23.1 W m-1 K-1 at 300 K along the [010] direction, and a lower value of 13.2 and 12.2 W m-1 K-1 along the [001] and [100] directions, respectively. A high ZT value of 1.07 at 1600 K can be obtained at the optimal carrier concentration of 2.4 × 1019 cm-3, which is superior to that of most other oxides such as ZnO. In addition, the lattice thermal conductivity can be reduced by precisely adjusting the grain size, and the lattice thermal conductivity at 300 K (1600 K) can be reduced by 73% (39%) when the grain size is decreased to 10 nm. The excellent thermoelectric properties of ß-Ga2O3 have promoted its potential application in the field of high temperature thermoelectric conversion.

High thermoelectric performance of topological half-Heusler compound LaPtBi achieved by hydrostatic pressure.

The topological phase transition and thermoelectric performance of LaPtBi under hydrostatic pressure up to 34.6 GPa have been systematically investigated using first-principles calculations based on density functional theory. The results indicate that the band structure can be tuned by applying hydrostatic pressure. As the energy band gap is opened under the hydrostatic pressure, a topological phase transition occurs in this material, changing from a topologically nontrivial semimetal to a trivial semiconductor. In addition, the hydrostatic pressure also has a remarkable effect on the thermoelectric properties of the topological half-Heusler compound LaPtBi. Though the lattice thermal conductivity shows a continuous increase with increasing hydrostatic pressure, the power factor is greatly enhanced due to the increase of the Seebeck coefficient. As a result, a maximum ZT value of 1.74 at 1000 K is achieved in n-type LaPtBi under pressure of 21.0 GPa. It is obvious that the thermoelectric figure of merit of LaPtBi is far beyond that of state-of-the-art half-Heusler thermoelectric materials, such as ZrNiSn, FeNbSb and TiCoSb. The realization of high thermoelectric performance in the half-Heusler compound LaPtBi under hydrostatic pressure could provide a new way to further explore other topological thermoelectric materials.

Extremely Low Lattice Thermal Conductivity and Significantly Enhanced Near-Room-Temperature Thermoelectric Performance in α-Cu2Se through the Incorporation of Porous Carbon.

In this work, a series of Cu2Se/x wt % porous carbon (PC) (x = 0, 0.2, 0.4, 0.6, 0.8, 1) composite materials were synthesized by ball milling and spark plasma sintering (SPS). The highly ordered porous carbon was synthesized by a hydrothermal method using mesoporous silica (SBA-15) as the template. X-ray diffraction results show that the incorporation of porous carbon induces a phase transition of Cu2Se from the ß phase to the α phase. Meanwhile, the addition of porous carbon reduces the carrier concentration from 2.7 × 1021 to 2.45 × 1020 cm-3 by 1 order of magnitude. The decrease of the carrier concentration leads to the reduction of electrical conductivity and the increase of the Seebeck coefficient, which results in the enhancement of the power factor. On the other hand, the incorporation of porous carbon into Cu2Se increases the porosity of the composites and also introduces more interfaces between the two materials, which is evidenced by positron annihilation lifetime measurements. Both pores and interfaces greatly enhance phonon scattering, leading to extremely low lattice thermal conductivity. In addition, the decrease of electrical conductivity also causes a sufficient reduction in electronic thermal conductivity. Due to the above synergistic effects, the thermoelectric performance of the Cu2Se/PC composite is significantly enhanced with a maximum ZT value of 0.92 at 403 K in the Cu2Se/1 wt % PC composite, which is close to that of the Bi2Te3-based materials. Our work shows that α-Cu2Se has great potential for near-room-temperature thermoelectric materials.

Extremely Low Lattice Thermal Conductivity Leading to Superior Thermoelectric Performance in Cu4TiSe4.

Low thermal conductivity is crucial for obtaining a promising thermoelectric (TE) performance in semiconductors. In this work, the TE properties of Cu4TiS4 and Cu4TiSe4 were theoretically investigated by carrying out first-principles calculations and solving Boltzmann transport equations. The calculated results reveal a lower sound velocity in Cu4TiSe4 compared to that in Cu4TiS4, which is due to the weaker chemical bonds in the crystal orbital Hamilton population (COHP) and also the larger atomic mass in Cu4TiSe4. In addition, the strong lattice anharmonicity in Cu4TiSe4 enhances phonon-phonon scattering, which shortens the phonon relaxation time. All of these factors lead to an extremely low lattice thermal conductivity (κL) of 0.11 W m-1 K-1 at room temperature in Cu4TiSe4 compared with that of 0.58 W m-1 K-1 in Cu4TiS4. Owing to the suitable band gaps of Cu4TiS4 and Cu4TiSe4, they also exhibit great electrical transport properties. As a result, the optimal ZT values for p (n)-type Cu4TiSe4 are up to 2.55 (2.88) and 5.04 (5.68) at 300 and 800 K, respectively. For p (n)-type Cu4TiS4, due to its low κL, the ZT can also reach high values over 2 at 800 K. The superior thermoelectric performance in Cu4TiSe4 demonstrates its great potential for applications in thermoelectric conversion.

Balanced High Thermoelectric Performance in n-Type and p-Type CuAgSe Realized through Vacancy Manipulation.

As a liquid-like material, CuAgSe has high carrier mobility and ultralow lattice thermal conductivity. It undergoes an n-p conduction-type transition during ß- to α-phase transition with increasing temperature. Moreover, optimization of the thermoelectric performance of CuAgSe is rather difficult, owing to the two-carrier conduction in this material. In this work, we reported the free tuning of the conduction type and thermoelectric performance of CuAgSe by manipulating the cation vacancies. Positron annihilation measurements reveal that the increase in CuAg content can effectively suppress the cation vacancies and reduce the hole carrier concentration, resulting in n-type conduction at high temperatures. Doping with Zn at the Cu sublattice in the CuAg-excessive CuAgSe can further decrease the number of vacancies, leading to a significant decrease in hole carrier concentration. Furthermore, the reduction of vacancies leads to weakening of carrier scattering. As a result, carrier mobility is also enhanced, thus improving the thermoelectric performance of n-type CuAgSe. On the other hand, high-performance p-type CuAgSe can be achieved by decreasing the CuAg content to introduce more cation vacancies. Ultimately, both n-type and p-type CuAgSe with superb thermoelectric performance are obtained, with a zTmax of 0.84 in Cu1.01Ag1.02Zn0.01Se (n-type) and 1.05 in (CuAg)0.96Se (p-type) at 600 K and average zT of 0.77 and 0.94 between 470 and 630 K for n-type and p-type, respectively.

First-Principles Study of Silicon-Tin Alloys as a High-Temperature Thermoelectric Material.

Silicon-germanium (SiGe) alloys have sparked a great deal of attention due to their exceptional high-temperature thermoelectric properties. Significant effort has been expended in the quest for high-temperature thermoelectric materials. Combining density functional theory and electron-phonon coupling theory, it was discovered that silicon-tin (SiSn) alloys have remarkable high-temperature thermoelectric performance. SiSn alloys have a figure of merit above 2.0 at 800 K, resulting from their high conduction band convergence and low lattice thermal conductivity. Further evaluations reveal that Si0.75Sn0.25 is the best choice for developing the optimum ratio as a thermoelectric material. These findings will provide a basis for further studies on SiSn alloys as a potential new class of high-performance thermoelectric materials.

Synergetic Optimization of Electrical and Thermal Transport Properties by Cu Vacancies and Nanopores in Cu2Se.

In this study, a series of Cu2+x-yInySe (-0.3 ≤ x ≤ 0.2 and 0 ≤ y ≤ 0.05) samples were prepared by melting and the spark plasma sintering method. X-ray diffraction measurements indicate that the Cu-deficient samples (x = -0.3 y = 0 and x = -0.2 y = 0) prefer to form the cubic phase (ß-Cu2Se). Adding excessive Cu or introducing In atoms into the Cu2Se matrix triggers a phase transition from the ß to α phase. Positron lifetime measurements confirm the reduction in Cu vacancy concentration by adding excessive Cu or introducing In atoms into Cu2Se, which causes a dramatic decrease in carrier concentration from 1.59 × 1021 to 5.0 × 1019 cm-3 at room temperature. The samples with In contents of 0.01 and 0.03 show a high power factor of about 1 mW m-1 K-2 at room temperature due to the optimization of the carrier concentration. Meanwhile, the excess Cu content and doping of In atoms also favor the formation of nanopores. These pores have strong interaction with phonons, leading to remarkable reduction in lattice thermal conductivity. Finally, a high ZT value of about 1.44 is achieved at 873 K in the Cu1.99In0.01Se (x = 0 and y = 0.01) sample, which is about twice that of the Cu-deficient sample (Cu1.7Se). Our work provides a viable insight into tuning vacancy defects to improve efficiently the electrical and thermal transport performance for copper-based thermoelectric materials.