Pose error correction in offline three-dimensional profile measurement system for large-diameter aspheric mirror.

This paper proposes an offline measurement method for a large aspheric mirror during its grinding stage. A measurement method and mathematical model to realize a three-dimensional (3D) profile measurement for large-diameter aspheric mirrors are proposed, based on a cylindrical coordinate system. The measurement error induced by the alignment error is examined based on the error analysis of the measurement and workpiece coordinate systems. The corresponding pose error obtained through the nonlinear least squares method is eliminated to improve the measurement accuracy. To evaluate the entire surface profile error, a 3D profile model is established. The total uncertainties of the proposed measurement system are also estimated. Comparison experiments for a 300-mm-diameter K9 glass workpiece are conducted on UPFM900 and Taylor Hobson PGI 3D profile instruments, and the profile accuracy is found to be improved from 15.3 to 7.12 µm after eccentricity and tilt error elimination.

Alignment Method for Linear-Scale Projection Lithography Based on CCD Image Analysis.

This paper presents a method to improve the alignment accuracy of a mask in linear scale projection lithography, in which the adjacent pixel gray square variance method is applied to a charge-coupled device (CCD) image to obtain the best position of the focal length of the motherboard and then realize the alignment of the focal plane. Two image positions in the focal plane of the CCD are compared with the traits overlap according to the image splicing principle, and four typical errors are corrected on the basis of the total grating errors. Simultaneously, the rotation error of the mask is used to summarize the grayscale variation function of the CCD image. Threshold functions are employed to express the factors including the wave crests of the amplitude, period error, and phase error, which govern the rotation accuracy and weight alignment accuracy expression of the established four error factors. Finally, in the experiment, the slope of the mask is corrected and adjusted to the same direction as the slide plate with the assistance of a dual-frequency laser interferometer. The effect of the alignment error on the lithography accuracy is discussed and verified in the static case, and it is found that the CCD maximum resolution pixel is 0.1 µm and accuracy of the scale is 0.79 µm in only a 200-mm-measurement range.

Multi-Repeated Projection Lithography for High-Precision Linear Scale Based on Average Homogenization Effect.

A multi-repeated photolithography method for manufacturing an incremental linear scale using projection lithography is presented. The method is based on the average homogenization effect that periodically superposes the light intensity of different locations of pitches in the mask to make a consistent energy distribution at a specific wavelength, from which the accuracy of a linear scale can be improved precisely using the average pitch with different step distances. The method's theoretical error is within 0.01 µm for a periodic mask with a 2-µm sine-wave error. The intensity error models in the focal plane include the rectangular grating error on the mask, static positioning error, and lithography lens focal plane alignment error, which affect pitch uniformity less than in the common linear scale projection lithography splicing process. It was analyzed and confirmed that increasing the repeat exposure number of a single stripe could improve accuracy, as could adjusting the exposure spacing to achieve a set proportion of black and white stripes. According to the experimental results, the effectiveness of the multi-repeated photolithography method is confirmed to easily realize a pitch accuracy of 43 nm in any 10 locations of 1 m, and the whole length accuracy of the linear scale is less than 1 µm/m.