RESUMO
This paper addresses the challenging issue of achieving high spatial resolution in temperature monitoring of printed circuit boards (PCBs) without compromising the operation of electronic components. Traditional methods involving numerous dedicated sensors such as thermocouples are often intrusive and can impact electronic functionality. To overcome this, this study explores the application of ultrasonic guided waves, specifically utilising a limited number of cost-effective and unobtrusive Piezoelectric Wafer Active Sensors (PWAS). Employing COMSOL multiphysics, wave propagation is simulated through a simplified PCB while systematically varying the temperature of both components and the board itself. Machine learning algorithms are used to identify hotspots at component positions using a minimal number of sensors. An accuracy of 97.6% is achieved with four sensors, decreasing to 88.1% when utilizing a single sensor in a pulse-echo configuration. The proposed methodology not only provides sufficient spatial resolution to identify hotspots but also offers a non-invasive and efficient solution. Such advancements are important for the future electrification of the aerospace and automotive industries in particular, as they contribute to condition-monitoring technologies that are essential for ensuring the reliability and safety of electronic systems.
RESUMO
The computer modelling of condition monitoring sensors can aide in their development, improve their performance, and allow for the analysis of sensor impact on component operation. This article details the development of a COMSOL model for a guided wave-based temperature monitoring system, with a view to using the technology in the future for the temperature monitoring of nozzle guide vanes, found in the hot section of aeroengines. The model is based on an experimental test system that acts as a method of validation for the model. Piezoelectric wedge transducers were used to excite the S0 Lamb wave mode in an aluminium plate, which was temperature controlled using a hot plate. Time of flight measurements were carried out in MATLAB and used to calculate group velocity. The results were compared to theoretical wave velocities extracted from dispersion curves. The assembly and validation of such a model can aide in the future development of guided wave based sensor systems, and the methods provided can act as a guide for building similar COMSOL models. The results show that the model is in good agreement with the experimental equivalent, which is also in line with theoretical predictions.