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Spatiotemporal Imaging of Thickness-Induced Band-Bending Junctions.
Wong, Joeson; Davoyan, Artur; Liao, Bolin; Krayev, Andrey; Jo, Kiyoung; Rotenberg, Eli; Bostwick, Aaron; Jozwiak, Chris M; Jariwala, Deep; Zewail, Ahmed H; Atwater, Harry A.
Afiliação
  • Davoyan A; Department of Mechanical and Aerospace Engineering, University of California, Los Angeles, California 90095 United States.
  • Liao B; Department of Mechanical Engineering, University of California, Santa Barbara, California 93106, United States.
  • Krayev A; Horiba Scientific, Novato, California 94949, United States.
  • Jo K; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.
  • Rotenberg E; Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, California 94720,United States.
  • Bostwick A; Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, California 94720,United States.
  • Jozwiak CM; Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, California 94720,United States.
  • Jariwala D; Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States.
Nano Lett ; 21(13): 5745-5753, 2021 07 14.
Article em En | MEDLINE | ID: mdl-34152777
ABSTRACT
van der Waals materials exhibit naturally passivated surfaces and an ability to form versatile heterostructures to enable an examination of carrier transport mechanisms not seen in traditional materials. Here, we report a new type of homojunction termed a "band-bending junction" whose potential landscape depends solely on the difference in thickness between the two sides of the junction. Using MoS2 on Au as a prototypical example, we find that surface potential differences can arise from the degree of vertical band bending in thin and thick regions. Furthermore, by using scanning ultrafast electron microscopy, we examine the spatiotemporal dynamics of charge carriers generated at this junction and find that lateral carrier separation is enabled by differences in the band bending in the vertical direction, which we verify with simulations. Band-bending junctions may therefore enable new optoelectronic devices that rely solely on band bending arising from thickness variations to separate charge carriers.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Diagnóstico por Imagem Tipo de estudo: Diagnostic_studies Idioma: En Revista: Nano Lett Ano de publicação: 2021 Tipo de documento: Article

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Diagnóstico por Imagem Tipo de estudo: Diagnostic_studies Idioma: En Revista: Nano Lett Ano de publicação: 2021 Tipo de documento: Article