Failures of Cu-Cu Joints under Temperature Cycling Tests.

Hsu, Po-Ning; Shie, Kai-Cheng; Tran, Dinh-Phuc; Tsou, Nien-Ti; Chen, Chih

Hsu, Po-Ning; Shie, Kai-Cheng; Tran, Dinh-Phuc; Tsou, Nien-Ti; Chen, Chih.

Afiliação

Hsu PN; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Shie KC; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
Tran DP; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Tsou NT; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
Chen C; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

Materials (Basel) ; 15(14)2022 Jul 15.

Article em En | MEDLINE | ID: mdl-35888410

Palavras-chave

Cu-Cu joints; FEA models; dielectrics; interfacial voids; stress gradients

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Materials (Basel) Ano de publicação: 2022 Tipo de documento: Article País de afiliação: Taiwan

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