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A Lightweight Method for Detecting IC Wire Bonding Defects in X-ray Images.
Zhan, Daohua; Lin, Jian; Yang, Xiuding; Huang, Renbin; Yi, Kunran; Liu, Maoling; Zheng, Hehui; Xiong, Jingang; Cai, Nian; Wang, Han; Qiu, Baojun.
Afiliação
  • Zhan D; State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangzhou 510006, China.
  • Lin J; School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China.
  • Yang X; State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangzhou 510006, China.
  • Huang R; School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China.
  • Yi K; State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangzhou 510006, China.
  • Liu M; School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China.
  • Zheng H; State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangzhou 510006, China.
  • Xiong J; School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China.
  • Cai N; State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangzhou 510006, China.
  • Wang H; School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, China.
  • Qiu B; State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangzhou 510006, China.
Micromachines (Basel) ; 14(6)2023 May 26.
Article em En | MEDLINE | ID: mdl-37374704

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Micromachines (Basel) Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Micromachines (Basel) Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China