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Manipulating 2D Materials through Strain Engineering.
Yu, Xiangxiang; Peng, Zhuiri; Xu, Langlang; Shi, Wenhao; Li, Zheng; Meng, Xiaohan; He, Xiao; Wang, Zhen; Duan, Shikun; Tong, Lei; Huang, Xinyu; Miao, Xiangshui; Hu, Weida; Ye, Lei.
Afiliação
  • Yu X; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • Peng Z; School of Physic and Optoelectronic Engineering, Yangtze University, Jingzhou, Hubei, 434023, China.
  • Xu L; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • Shi W; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • Li Z; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • Meng X; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • He X; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • Wang Z; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • Duan S; State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, 200083, China.
  • Tong L; State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, 200083, China.
  • Huang X; Department of Electronic Engineering, Materials Science and Technology Research Center, The Chinese University of Hong Kong, Hong Kong, 999077, China.
  • Miao X; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • Hu W; School of Integrated Circuits, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
  • Ye L; Hubei Yangtze Memory Laboratories, Wuhan, 430205, China.
Small ; : e2402561, 2024 May 31.
Article em En | MEDLINE | ID: mdl-38818684
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2024 Tipo de documento: Article País de afiliação: China
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2024 Tipo de documento: Article País de afiliação: China