Development of a Charge-Multiplication CMOS Image Sensor Based on Capacitive Trench for Low-Light-Level Imaging.

This paper presents an electron multiplication charge coupled device (EMCCD) based on capacitive deep trench isolation (CDTI) and developed using complementary metal oxide semiconductor (CMOS) technology. The CDTI transfer register offers a charge transfer inefficiency lower than 10-4 and a low dark current o 0.11nA/cm2 at room temperature. In this work, the timing diagram is adapted to use this CDTI transfer register in an electron multiplication mode. The results highlight some limitations of this device in such an EM configuration: for instance, an unexpected increase in the dark current is observed. A design modification is then proposed to overcome these limitations and rely on the addition of an electrode on the top of the register. Thus, this new device preserves the good transfer performance of the register while adding an electron multiplication function. Technology computer-aided design (TCAD) simulations in 2D and 3D are performed with this new design and reveal a very promising structure.

Evaluation of Microlenses, Color Filters, and Polarizing Filters in CIS for Space Applications.

For the last two decades, the CNES optoelectronics detection department and partners have evaluated space environment effects on a large panel of CMOS image sensors (CIS) from a wide range of commercial foundries and device providers. Many environmental tests have been realized in order to provide insights into detection chain degradation in modern CIS for space applications. CIS technology has drastically improved in the last decade, reaching very high performances in terms of quantum efficiency (QE) and spectral selectivity. These improvements are obtained thanks to the introduction of various components in the pixel optical stack, such as microlenses, color filters, and polarizing filters. However, since these parts have been developed only for commercial applications suitable for on-ground environment, it is crucial to evaluate if these technologies can handle space environments for future space imaging missions. There are few results on that robustness in the literature. The objective of this article is to give an overview of CNES and partner experiments from numerous works, showing that the performance gain from the optical stack is greater than the degradation induced by the space environment. Consequently, optical stacks can be used for space missions because they are not the main contributor to the degradation in the detection chain.

Integration of nanostructured planar diffractive lenses dedicated to near infrared detection for CMOS image sensors.

This paper deals with the integration of metallic and dielectric nanostructured planar lenses into a pixel from a silicon based CMOS image sensor, for a monochromatic application at 1.064 µm. The first is a Plasmonic Lens, based on the phase delay through nanoslits, which has been found to be hardly compatible with current CMOS technology and exhibits a notable metallic absorption. The second is a dielectric Phase-Fresnel Lens integrated at the top of a pixel, it exhibits an Optical Efficiency (OE) improved by a few percent and an angle of view of 50°. The third one is a metallic diffractive lens integrated inside a pixel, which shows a better OE and an angle of view of 24°. The last two lenses exhibit a compatibility with a spectral band close to 1.064 µm.