High-power and reliable GaN-based vertical light-emitting diodes on 4-inch silicon substrate.

High-power and reliable GaN-based vertical light-emitting diodes (V-LEDs) on 4-inch silicon substrate were fabricated and characterized in this article. The metallization scheme reliability was improved by depositing the Pt/Ti films that surround the compressed Ag/TiW films to protect it from environmental humidity. We demonstrated that although current crowding in V-LEDs was not as severe as that in lateral light-emitting diodes (L-LEDs), high current density around the opaque metal n-electrode in V-LEDs remained a problem. A SiO2 current blocking layer (CBL) was incorporated in V-LEDs to modify the current distribution. Roughening the emitting surface of V-LEDs with KOH and H3PO4 etchant was compared and the influence of surface roughening on the emission property of V-LEDs was studied. The high-power V-LEDs showed low forward voltage with small series resistance and high light output power (LOP) without saturation up to 1300 mA. Under 350 mA injection current, V-LEDs achieved an excellent light output power (LOP) of 501 mW with the peak emission wavelength at 453 nm. The prominent output performance of V-LEDs demonstrated in this work confirmed that integrating the optimized metallization scheme, SiO2 CBL and surface texturing by KOH wet etching is an effective approach to higher performance V-LEDs.

Highly efficient GaN-based high-power flip-chip light-emitting diodes.

High-power flip-chip light-emitting diodes (FCLEDs) suffer from low efficiencies because of poor p-type reflective ohmic contact and severe current crowding. Here, we show that it is possible to improve both the light extraction efficiency (LEE) and current spreading of an FCLED by incorporating a highly reflective metallic reflector made from silver (Ag). The reflector, which consists of an Ag film covered by three pairs of TiW/Pt multilayers, demonstrates high reflectance of 95.0% at 460 nm at arbitrary angles of incidence. Our numerical simulation and experimental results reveal that the FCLED with Ag-based reflector exhibits higher LEE and better current spreading than the FCLED with indium-tin oxide (ITO)/distributed Bragg reflector (DBR). As a result, the external quantum efficiency (EQE) of FCLED with Ag-based reflector was 6.0% higher than that of FCLED with ITO/DBR at 750 mA injection current. Our work also suggests that the EQE of FCLED with the Ag-based reflector could be further enhanced 5.2% by replacing the finger-like n-electrodes with three-dimensional (3D) vias n-electrodes, which spread the injection current uniformly over the entire light-emitting active region. This study paves the way towards higher-performance LED technology.

Numerical and experimental investigation of GaN-based flip-chip light-emitting diodes with highly reflective Ag/TiW and ITO/DBR Ohmic contacts.

We demonstrate two types of GaN-based flip-chip light-emitting diodes (FCLEDs) with highly reflective Ag/TiW and indium-tin oxide (ITO)/distributed Bragg reflector (DBR) p-type Ohmic contacts. We show that a direct Ohmic contact to p-GaN layer using pure Ag is obtained when annealed at 600°C in N2 ambient. A TiW diffusion barrier layer covered onto Ag is used to suppress the agglomeration of Ag and thus maintain high reflectance of Ag during high temperature annealing process. We develop a strip-shaped SiO2 current blocking layer beneath the ITO/DBR to alleviate current crowding occurring in FCLED with ITO/DBR. Owing to negligibly small spreading resistance of Ag, however, our combined numerical and experimental results show that the FCLED with Ag/TiW has a more favorable current spreading uniformity in comparison to the FCLED with ITO/DBR. As a result, the light output power of FCLED with Ag/TiW is 7.5% higher than that of FCLED with ITO/DBR at 350 mA. The maximum output power of the FCLED with Ag/TiW obtained at 305.6 A/cm2 is 29.3% larger than that of the FCLED with ITO/DBR obtained at 278.9 A/cm2. The improvement appears to be due to the enhanced current spreading and higher optical reflectance provided by the Ag/TiW.

Numerical simulation and experimental investigation of GaN-based flip-chip LEDs and top-emitting LEDs.

We demonstrate a GaN-based flip-chip LED (FC-LED) with a highly reflective indium-tin oxide (ITO)/distributed Bragg reflector (DBR) ohmic contact. A transparent ITO current spreading layer combined with Ta2O5/SiO2 double DBR stacks is used as a reflective p-type ohmic contact in the FC-LED. We develop a strip-shaped SiO2 current blocking layer, which is well aligned with a p-electrode, to prevent the current from crowding around the p-electrode. Our combined numerical simulation and experimental results revealed that the FC-LED with ITO/DBR has advantages of better current spreading and superior heat dissipation performance compared to top-emitting LEDs (TE-LEDs). As a result, the light output power (LOP) of the FC-LED with ITO/DBR was 7.6% higher than that of the TE-LED at 150 mA, and the light output saturation current was shifted from 130.9 A/cm2 for the TE-LED to 273.8 A/cm2 for the FC-LED with ITO/DBR. Owing to the high reflectance of the ITO/DBR ohmic contact, the LOP of the FC-LED with ITO/DBR was 13.0% higher than that of a conventional FC-LED with Ni/Ag at 150 mA. However, because of the better heat dissipation of the Ni/Ag ohmic contact, the conventional FC-LED with Ni/Ag exhibited higher light output saturation current compared to the FC-LED with ITO/DBR.

Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall.

Current solutions for improving the light extraction efficiency of flip-chip light-emitting diodes (LEDs) mainly focus on relieving the total internal reflection at sapphire/air interface, but such methods hardly affect the epilayer mode photons. We demonstrated that the prism-structured sidewall based on tetramethylammonium hydroxide (TMAH) etching is a cost-effective solution for promoting light extraction efficiency of flip-chip mini-LEDs. The anisotropic TMAH etching created hierarchical prism structure on sidewall of mini-LEDs for coupling out photons into air without deteriorating the electrical property. Prism-structured sidewall effectively improved light output power of mini-LEDs by 10.3%, owing to the scattering out of waveguided light trapped in the gallium nitride (GaN) epilayer.