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Effects of Environmental Conditions on Interfacial Adhesion Between Screen-Printed Ag Film and Polyimide Substrate.
Lee, Hyeonchul; Bae, Byung-Hyun; Kim, Gahui; Son, Kirak; Kim, Byoung-Joon; Park, Young-Bae.
Afiliación
  • Lee H; STATS ChipPAC Korea Ltd., Incheon, 22379, Korea.
  • Bae BH; VITZROTECH Co., Ltd., Ansan-si 15603, Korea.
  • Kim G; School of Materials Science and Engineering, Andong National University, Andong-si 36729, Korea.
  • Son K; School of Materials Science and Engineering, Andong National University, Andong-si 36729, Korea.
  • Kim BJ; School of Materials Science and Engineering, Andong National University, Andong-si 36729, Korea.
  • Park YB; School of Materials Science and Engineering, Andong National University, Andong-si 36729, Korea.
J Nanosci Nanotechnol ; 20(1): 206-212, 2020 Jan 01.
Article en En | MEDLINE | ID: mdl-31383157
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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: J Nanosci Nanotechnol Año: 2020 Tipo del documento: Article
Texto completo
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XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: J Nanosci Nanotechnol Año: 2020 Tipo del documento: Article