Triple-layered optical interconnecting integrated waveguide chip based on epoxy cross-linking fluorinated polymer photonic platform.
Opt Express
; 31(12): 19415-19427, 2023 Jun 05.
Article
en En
| MEDLINE
| ID: mdl-37381357
ABSTRACT
In this study, a triple-layered optical interconnecting integrated waveguide chip was designed and fabricated using an epoxy cross-linking polymer photonic platform. Fluorinated photopolymers FSU-8 and AF-Z-PC EP were self-synthesized as waveguide cores and cladding materials, respectively. The triple-layered optical interconnecting waveguide device comprised 4 × 4 arrayed waveguide grating (AWG) -based wavelength-selective switching (WSS) arrays, 4 × 4 multi-mode interference (MMI) -cascaded channel-selective switching (CSS) arrays, and 3 × 3 direct-coupling (DC) interlayered switching arrays. The overall optical polymer waveguide module was fabricated by direct UV writing. For the multilayered WSS arrays, the wavelength-shifting sensitivity was â¼0.48â
nm/°C. For the multilayered CSS arrays, the average switching time was â¼280 µs, and the maximum power consumption was <30â
mW. For interlayered switching arrays, the extinction ratio approximated 15.2â
dB. The transmission loss for the triple-layered optical waveguide chip was measured as 10.0-12.1â
dB. The flexible multilayered photonic integrated circuits (PIC) can be used in high-density integrated optical interconnecting systems with a large-volume optical information transmission capacity.
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01-internacional
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MEDLINE
Idioma:
En
Revista:
Opt Express
Asunto de la revista:
OFTALMOLOGIA
Año:
2023
Tipo del documento:
Article