Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.

Lin, Po-Fan; Tran, Dinh-Phuc; Liu, Hung-Che; Li, Yi-Yi; Chen, Chih

Lin, Po-Fan; Tran, Dinh-Phuc; Liu, Hung-Che; Li, Yi-Yi; Chen, Chih.

Afiliação

Lin PF; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Tran DP; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
Liu HC; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.
Li YY; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan.
Chen C; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

Materials (Basel) ; 15(3)2022 Jan 26.

Article em En | MEDLINE | ID: mdl-35160883

Palavras-chave

Cu-to-Cu bonding; chemical mechanical planarization; nanotwinned copper

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Materials (Basel) Ano de publicação: 2022 Tipo de documento: Article País de afiliação: Taiwan

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