An ultrasmall organic synapse for neuromorphic computing.

Liu, Shuzhi; Zeng, Jianmin; Wu, Zhixin; Hu, Han; Xu, Ao; Huang, Xiaohe; Chen, Weilin; Chen, Qilai; Yu, Zhe; Zhao, Yinyu; Wang, Rong; Han, Tingting; Li, Chao; Gao, Pingqi; Kim, Hyunwoo; Baik, Seung Jae; Zhang, Ruoyu; Zhang, Zhang; Zhou, Peng; Liu, Gang

Liu, Shuzhi; Zeng, Jianmin; Wu, Zhixin; Hu, Han; Xu, Ao; Huang, Xiaohe; Chen, Weilin; Chen, Qilai; Yu, Zhe; Zhao, Yinyu; Wang, Rong; Han, Tingting; Li, Chao; Gao, Pingqi; Kim, Hyunwoo; Baik, Seung Jae; Zhang, Ruoyu; Zhang, Zhang; Zhou, Peng; Liu, Gang.

Afiliação

Liu S; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
Zeng J; School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
Wu Z; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
Hu H; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
Xu A; Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China.
Huang X; School of Microelectronics, Hefei University of Technology, Hefei, 230601, China.
Chen W; State Key Laboratory of ASIC and Systems, School of Microelectronics, Fudan University, Shanghai, 200433, China.
Chen Q; Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
Yu Z; School of Materials, Sun Yat-Sen University, Guangzhou, Guangdong, 510275, China.
Zhao Y; School of Materials, Sun Yat-Sen University, Guangzhou, Guangdong, 510275, China.
Wang R; Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China.
Han T; Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China.
Li C; School of Microelectronics, Hefei University of Technology, Hefei, 230601, China.
Gao P; School of Microelectronics, Hefei University of Technology, Hefei, 230601, China.
Kim H; School of Materials, Sun Yat-Sen University, Guangzhou, Guangdong, 510275, China.
Baik SJ; School of Electronic and Electrical Engineering, Hankyong National University, Anseong-si, Gyeonggi-do, 17579, Korea.
Zhang R; School of Electronic and Electrical Engineering, Hankyong National University, Anseong-si, Gyeonggi-do, 17579, Korea.
Zhang Z; Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China. zhangruoy@nimte.ac.cn.
Zhou P; School of Microelectronics, Hefei University of Technology, Hefei, 230601, China. zhangzhang@hfut.edu.cn.
Liu G; State Key Laboratory of ASIC and Systems, School of Microelectronics, Fudan University, Shanghai, 200433, China. pengzhou@fudan.edu.cn.

Nat Commun ; 14(1): 7655, 2023 Nov 23.

Article em En | MEDLINE | ID: mdl-37996491

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nat Commun Assunto da revista: BIOLOGIA / CIENCIA Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China

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