Multiscale transfer printing into recessed microwells and on curved surfaces via hierarchical perfluoropolyether stamps.

A simple method for the formation of multiscale metal patterns is presented using hierarchical polymeric stamps with perfluoropolyether (PFPE). A dual-scale PFPE structure is made via two-step moulding process under partial photocrosslinking conditions. The hierarchical PFPE stamp enables multiscale transfer printing (MTP) of metal pattern in one step within microwells as well as on curved surfaces.

Recent advances in wrinkle-based dry adhesion.

Surface wrinkles driven by elastic instabilities have attracted significant interest in the field of materials science and engineering. They are simple and readily fabricated with various patterns of tunable size, morphology and surface topography from a wide range of material systems. Recently, they have been investigated as a new type of dry adhesives. In this review, after a brief introduction of different methods to prepare wrinkle surfaces, we focus on the investigation of dry adhesion mechanisms in different material systems. By exploiting wrinkle dimension, morphology, modulus, curvature, and different contacting surfaces (flat, hemispherical, spherical) and their complementarity, we show adhesion enhancement, reduction and selectivity. By comparing experimental results with theoretical predictions, we aim to provide a guideline to design and engineer wrinkle-based dry adhesives. Several examples of applications of engineered wrinkles are also demonstrated, including pick, release and transfer of nanoparticles and bulk materials, and gecko-like hybrid adhesives. The review is concluded with perspectives on the wrinkling technology for smart dry adhesives.

Wrinkled, dual-scale structures of diamond-like carbon (DLC) for superhydrophobicity.

We present a simple two-step method to fabricate dual-scale superhydrophobic surfaces by using replica molding of poly(dimethylsiloxane) (PDMS) micropillars, followed by deposition of a thin, hard coating layer of a SiO(x)-incorporated diamond-like carbon (DLC). The resulting surface consists of microscale PDMS pillars covered by nanoscale wrinkles that are induced by residual compressive stress of the DLC coating and a difference in elastic moduli between DLC and PDMS without any external stretching or thermal contraction on the PDMS substrate. We show that the surface exhibits superhydrophobic properties with a static contact angle over 160 degrees for micropillar spacing ratios (interpillar gap divided by diameter) less than 4. A transition of the wetting angle to approximately 130 degrees occurs for larger spacing ratios, changing the wetting from a Cassie-Cassie state (C(m)-C(n)) to a Wenzel-Cassie state (W(m)-C(n)), where m and n denote micro- and nanoscale roughness, respectively. The robust superhydrophobicity of the Cassie-Cassie state is attributed to stability of the Cassie state on the nanoscale wrinkle structures of the hydrophobic DLC coating, which is further explained by a simple mathematical theory on wetting states with decoupling of nano- and microscale roughness in dual scale structures.

Transparent and Superamphiphobic Surfaces from Mushroom-Like Micropillar Arrays.

Transparent, superamphiphobic surfaces that repel both water and oils are prepared from mushroom-like micropillar arrays consisting of nanoparticles only at the top of the pillars by controlled compartment filling of silica nanoparticles into the bottom of the poly(dimethylsiloxane) (PDMS) mold, followed by infiltration of epoxy and UV curing. Because silica nanoparticle decorated pillar heads are more resistant to O2 plasma than the polymer pillars, we can precisely control the head size of micropillars and nanoroughness on top of the pillar heads by varying the O2 plasma time. The combination of nanoroughness and mushroom-like micropillars leads to superhydrophobicity and oil repellency to different organic solvents. High transparency is achieved by increasing the spacing ratio of micropillars. Last, we demonstrate anisotropic wetting on the hierarchical surface can be achieved by combining photolithography, replica molding, and self-assembly techniques.

Beetle-inspired bidirectional, asymmetric interlocking using geometry-tunable nanohairs.

We present bidirectional, asymmetric interlocking behaviors between tilted micro- and nanohair arrays inspired from the actual wing locking device of beetles. The measured shear adhesion force between two identical tilted microhair arrays (1.5 µm radius, 30 µm height) turned out to be higher in the reverse direction than that in the angled direction, suggesting that the directionality of beetle's microtrichia may play a critical role in preventing the elytra from shifting along the middle of insect body. Furthermore, we observed dramatic enhancement of shear adhesion using asymmetric interlocking of various nanohair arrays (tilting angle, δ < 40°). A maximum shear locking force of ∼60 N/cm(2) was measured for the nanohair arrays of 50 nm radius and 1 µm height with a hysteresis as high as ∼3. A simple theoretical model was developed to describe the measured asymmetric adhesion forces and hysteresis, in good agreement with the experimental data.

Pitch reduction lithography by pressure-assisted selective wetting and thermal reflow.

We report on a new pitch reduction lithographic technique by utilizing pressure-assisted selective wetting and thermal reflow. The primary line-and-space pattern of low molecular weight polystyrene (PS) (Mw=17,300) was formed by solvent-assisted capillary force lithography (CFL), on which a diluted photoresist (PR) solution was selectively filled into the spaces by the application of a slight pressure (200 g cm(-2)). Subsequent removal of the PS pattern by toluene and ashing process led to a line pattern with approximately 50% pitch reduction. It was observed that the size reduction and space to width ratios were controllable by changing PR concentration and ashing time.

One-step process for superhydrophobic metallic surfaces by wire electrical discharge machining.

We present a direct one-step method to fabricate dual-scale superhydrophobic metallic surfaces using wire electrical discharge machining (WEDM). A dual-scale structure was spontaneously formed by the nature of exfoliation characteristic of Al 7075 alloy surface during WEDM process. A primary microscale sinusoidal pattern was formed via a programmed WEDM process, with the wavelength in the range of 200 to 500 µm. Notably, a secondary roughness in the form of microcraters (average roughness, Ra: 4.16 to 0.41 µm) was generated during the exfoliation process without additional chemical treatment. The low surface energy of Al 7075 alloy (γ = 30.65 mJ/m(2)) together with the presence of dual-scale structures appears to contribute to the observed superhydrophobicity with a static contact angle of 156° and a hysteresis less than 3°. To explain the wetting characteristics on dual-scale structures, we used a simple theoretical model. It was found that Cassie state is likely to present on the secondary roughness in all fabricated surfaces. On the other hand, either Wenzel or Cassie state can present on the primary roughness depending on the characteristic length of sinusoidal pattern. In an optimal condition of the serial cutting steps with applied powers of ∼30 and ∼8 kW, respectively, a stable, superhydrophobic metallic surface was created with a sinusoidal pattern of 500 µm wavelength.