Squeeze Film Air Damping in Tapping Mode Atomic Force Microscopy.

Zhao, Yang; Huang, Qiangxian; Zhang, Liansheng; Zhang, Yong; Cheng, Rongjun

Zhao, Yang; Huang, Qiangxian; Zhang, Liansheng; Zhang, Yong; Cheng, Rongjun.

Afiliação

Zhao Y; School of Instrument Science and Opto-electronics Engineering, Hefei University of Technology, Hefei 230009, China. zhaoyang@ahjzu.edu.cn.
Huang Q; School of Electronics and Information Engineering, Anhui Jianzhu University, Hefei 230601, China. zhaoyang@ahjzu.edu.cn.
Zhang L; School of Instrument Science and Opto-electronics Engineering, Hefei University of Technology, Hefei 230009, China. huangqx@hfut.edu.cn.
Zhang Y; School of Instrument Science and Opto-electronics Engineering, Hefei University of Technology, Hefei 230009, China. lszhang@hfut.edu.cn.
Cheng R; School of Instrument Science and Opto-electronics Engineering, Hefei University of Technology, Hefei 230009, China. zhangy@hfut.edu.cn.

Micromachines (Basel) ; 8(7)2017 Jul 20.

Article em En | MEDLINE | ID: mdl-30400416

Palavras-chave

atomic force microscopy; damping coefficient; dynamic plowing lithography; squeeze film air damping

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Micromachines (Basel) Ano de publicação: 2017 Tipo de documento: Article País de afiliação: China

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