Thick, Adherent Diamond Films on AlN with Low Thermal Barrier Resistance.

Mandal, Soumen; Yuan, Chao; Massabuau, Fabien; Pomeroy, James W; Cuenca, Jerome; Bland, Henry; Thomas, Evan; Wallis, David; Batten, Tim; Morgan, David; Oliver, Rachel; Kuball, Martin; Williams, Oliver A

Mandal, Soumen; Yuan, Chao; Massabuau, Fabien; Pomeroy, James W; Cuenca, Jerome; Bland, Henry; Thomas, Evan; Wallis, David; Batten, Tim; Morgan, David; Oliver, Rachel; Kuball, Martin; Williams, Oliver A.

Afiliação

Yuan C; Center for Device Thermography and Reliability , University of Bristol , Bristol BS8 1TL , U.K.
Massabuau F; Department of Materials Science & Metallurgy , University of Cambridge , Cambridge CB3 0FS , U.K.
Pomeroy JW; Center for Device Thermography and Reliability , University of Bristol , Bristol BS8 1TL , U.K.
Wallis D; Department of Materials Science & Metallurgy , University of Cambridge , Cambridge CB3 0FS , U.K.
Batten T; Renishaw plc. , Wotton-under-Edge GL12 7DW , U.K.
Morgan D; Cardiff Catalysis Institute, School of Chemistry , Cardiff University , Cardiff CF10 3AT , U.K.
Oliver R; Department of Materials Science & Metallurgy , University of Cambridge , Cambridge CB3 0FS , U.K.
Kuball M; Center for Device Thermography and Reliability , University of Bristol , Bristol BS8 1TL , U.K.

ACS Appl Mater Interfaces ; 11(43): 40826-40834, 2019 Oct 30.

Article em En | MEDLINE | ID: mdl-31603642

Palavras-chave

aluminum nitride; diamond; diamond growth; diamond seeding; thermal barrier resistance

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2019 Tipo de documento: Article

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