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Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks.
Kim, Jeongah; Kim, Bo-Young; Park, Seong Dae; Seo, Ji-Hun; Lee, Chan-Jae; Yoo, Myong Jae; Kim, Youngmin.
Afiliação
  • Kim J; Electronic Materials & Device Research Center, Korea Electronics Technology Institute, Seongnam 463-816, Korea.
  • Kim BY; Department of Materials Science and Engineering, Korea University, Seoul 136-701, Korea.
  • Park SD; Electronic Materials & Device Research Center, Korea Electronics Technology Institute, Seongnam 463-816, Korea.
  • Seo JH; Electronic Materials & Device Research Center, Korea Electronics Technology Institute, Seongnam 463-816, Korea.
  • Lee CJ; Department of Materials Science and Engineering, Korea University, Seoul 136-701, Korea.
  • Yoo MJ; Display Research Center, Korea Electronics Technology Institute, Seongnam 463-816, Korea.
  • Kim Y; Electronic Materials & Device Research Center, Korea Electronics Technology Institute, Seongnam 463-816, Korea.
Micromachines (Basel) ; 12(8)2021 Aug 10.
Article em En | MEDLINE | ID: mdl-34442565
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Micromachines (Basel) Ano de publicação: 2021 Tipo de documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Micromachines (Basel) Ano de publicação: 2021 Tipo de documento: Article