Electrically Conductive Adhesive Based on Thermoplastic Hot Melt Copolyamide and Multi-Walled Carbon Nanotubes.

Latko-Duralek, Paulina; Misiak, Michal; Boczkowska, Anna

Latko-Duralek, Paulina; Misiak, Michal; Boczkowska, Anna.

Afiliação

Latko-Duralek P; Faculty of Materials Science and Engineering, Warsaw University of Technology, Woloska 141 Street, 02-507 Warsaw, Poland.
Misiak M; Technology Partners Foundation, Pawinskiego 5A Street, 02-106 Warsaw, Poland.
Boczkowska A; Faculty of Materials Science and Engineering, Warsaw University of Technology, Woloska 141 Street, 02-507 Warsaw, Poland.

Polymers (Basel) ; 14(20)2022 Oct 17.

Article em En | MEDLINE | ID: mdl-36297949

Palavras-chave

adhesion; carbon nanotubes; hot melt adhesive; microstructure; rheology

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Polymers (Basel) Ano de publicação: 2022 Tipo de documento: Article País de afiliação: Polônia

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