Solid-state thermal rectification of bilayers by asymmetric elastic modulus.

A highly efficient thermal rectification applicable to large panels still needs to be developed. Here, we experimentally achieve a high thermal rectification efficiency of 33% by carefully engineering elastic modulus asymmetry in a centimeter-scale bilayered silver-graphene oxide sponge. The thermal conduction primarily occurs in the out-of-plane direction, and the forward heat flow direction is from the hard silver to the soft graphene oxide. Surprisingly, the forward heat flow direction is reversed when a silver layer is formed on a harder polystyrene foam. The forward direction is always from the harder side to the softer side, and the asymmetry in elastic modulus is suggested as a possible mechanism based on the one-dimensional Frenkel-Kontorova (FK) model. The finite element analysis indicates that other mechanisms such as temperature-dependent thermal conductivity and radiation asymmetry cannot explain the high rectification efficiency. This scalable work over a wide temperature range may find immediate industrial applications.

Tunable solid-state thermal rectification by asymmetric nonlinear radiation.

Thermal rectification is a direction-dependent asymmetric heat transport phenomenon. Here we report the tunable solid-state thermal rectification by asymmetric nonlinear far-field radiation. The asymmetry in thermal conductivity and emissivity of a three-terminal device is realized by sputtering a thin metal film (radiation barrier: niobium, copper, or silver) on the top right half of a polyethylene terephthalate strip (emitter). Both the experiment and finite element analysis are in excellent agreement, revealing a thermal rectification ratio (TR) of 13.0% for the niobium-deposited specimen. The simulation demonstrates that the TR can be further increased to 74.5% by tuning asymmetry in thermal conductivity, emissivity, and surface area. The rectification can also be actively controlled, by gating the environmental temperature, resulting in a maximum TR of 93.1%. This work is applicable for a wide range of temperatures and device sizes, which may find applications in on-demand heat control and thermal logic gates.