RESUMEN
Further improvements in perovskite solar cells require better control of ionic defects in the perovskite photoactive layer during the manufacturing stage and their usage1-5. Here we report a living passivation strategy using a hindered urea/thiocarbamate bond6-8 Lewis acid-base material (HUBLA), where dynamic covalent bonds with water and heat-activated characteristics can dynamically heal the perovskite to ensure device performance and stability. Upon exposure to moisture or heat, HUBLA generates new agents and further passivates defects in the perovskite. This passivation strategy achieved high-performance devices with a power conversion efficiency (PCE) of 25.1 per cent. HUBLA devices retained 94 per cent of their initial PCE for approximately 1,500 hours of ageing at 85 degrees Celsius in nitrogen and maintained 88 per cent of their initial PCE after 1,000 hours of ageing at 85 degrees Celsius and 30 per cent relative humidity in air.
RESUMEN
The recent use of cryoprotectant replacement method for solving the easy drying problem of hydrogels has attracted increasing research interest. However, the conductivity decrease of organohydrogels due to the induced insulating solvent limited their electronic applications. Herein, we introduce the Hofmeister effect and electrostatic interaction to generate hydrogen and sodium bonds in the hydrogel. Combined with its double network, an effective charge channel that will not be affected by the solvent replacement, is therefore built. The developed organohydrogel-based single-electrode triboelectric nanogenerator (OHS-TENG) shows low conductivity decrease (one order) and high output (1.02-1.81 W/m2), which is much better than reported OHS-TENGs (2-3 orders, 41.2-710 mW/m2). Moreover, replacing water with glycerol in the hydrogel enables the device to exhibit excellent long-term stability (four months) and temperature tolerance (-50-100 °C). The presented strategy and mechanism can be extended to common organohydrogel systems aiming at high performance in electronic applications.