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In situ preparation of an ultra-thin nanomask on a silicon wafer.
Mao, R W; Lin, S K; Tsai, C S.
Afiliación
  • Mao RW; Department of Electrical Engineering and Computer Science, and Institute for Surface and Interface Science, University of California, Irvine, CA 92697, USA.
Nanotechnology ; 20(2): 025301, 2009 Jan 14.
Article en En | MEDLINE | ID: mdl-19417267
Porous nanomasks have been prepared in situ on an insulating silicon wafer by anodization of an aluminum film grown on it. Ultra-thin nanomasks, around 50 nm thick, were fabricated by utilizing a stop signal, a vivid color appearing at the air-electrolyte interface, and the process involved showed excellent repeatability. Finally, 2D nanoscale p-n junction arrays were fabricated on a silicon on insulator (SOI) wafer using the ultra-thin nanomasks prepared. The experimental results are in good agreement with the simulated results on the characteristics of the anodization process involved.

Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Nanotechnology Año: 2009 Tipo del documento: Article País de afiliación: Estados Unidos

Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Nanotechnology Año: 2009 Tipo del documento: Article País de afiliación: Estados Unidos