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A van der Waals Integrated Damage-Free Memristor Based on Layered 2D Hexagonal Boron Nitride.
Mao, Jing-Yu; Wu, Shuang; Ding, Guanglong; Wang, Zhan-Peng; Qian, Fang-Sheng; Yang, Jia-Qin; Zhou, Ye; Han, Su-Ting.
Afiliación
  • Mao JY; Institute for Advanced Study, Shenzhen University, Shenzhen, 518060, P. R. China.
  • Wu S; Department of Physics, National University of Singapore, Singapore, 117542, Singapore.
  • Ding G; Institute for Advanced Study, Shenzhen University, Shenzhen, 518060, P. R. China.
  • Wang ZP; Institute for Advanced Study, Shenzhen University, Shenzhen, 518060, P. R. China.
  • Qian FS; Institute for Advanced Study, Shenzhen University, Shenzhen, 518060, P. R. China.
  • Yang JQ; Institute for Advanced Study, Shenzhen University, Shenzhen, 518060, P. R. China.
  • Zhou Y; Institute of Microscale Optoelectronics, Shenzhen University, Shenzhen, 518060, P. R. China.
  • Han ST; Institute for Advanced Study, Shenzhen University, Shenzhen, 518060, P. R. China.
Small ; 18(12): e2106253, 2022 Mar.
Article en En | MEDLINE | ID: mdl-35083839
ABSTRACT
2D materials with intriguing properties have been widely used in optoelectronics. However, electronic devices suffered from structural damage due to the ultrathin materials and uncontrolled defects at interfaces upon metallization, which hindered the development of reliable devices. Here, a damage-free Au/h-BN/Au memristor is reported using a clean, water-assisted metal transfer approach by physically assembling Au electrodes onto the layered h-BN which minimized the structural damage and undesired interfacial defects. The memristors demonstrate significantly improved performance with the coexistence of nonpolar and threshold switching as well as tunable current levels by controlling the compliance current, compared with devices with evaporated contacts. The devices integrated into an array show suppressed sneak path current and can work as both logic gates and latches to implement logic operations allowing in-memory computing. Cross-sectional scanning transmission electron microscopy analysis validates the feasibility of this nondestructive metal integration approach, the crucial role of high-quality atomically sharp interface in resistive switching, and a direct observation of percolation path. The underlying mechanism of boron vacancies-assisted transport is further supported experimentally by conductive atomic force microscopy free from process-induced damage, and theoretically by ab initio simulations.
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Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Small Asunto de la revista: ENGENHARIA BIOMEDICA Año: 2022 Tipo del documento: Article

Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Small Asunto de la revista: ENGENHARIA BIOMEDICA Año: 2022 Tipo del documento: Article