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High-performance piezoelectric composites via ß phase programming.
Su, Yuanjie; Li, Weixiong; Cheng, Xiaoxing; Zhou, Yihao; Yang, Shuai; Zhang, Xu; Chen, Chunxu; Yang, Tiannan; Pan, Hong; Xie, Guangzhong; Chen, Guorui; Zhao, Xun; Xiao, Xiao; Li, Bei; Tai, Huiling; Jiang, Yadong; Chen, Long-Qing; Li, Fei; Chen, Jun.
Afiliación
  • Su Y; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, 610054, Chengdu, China.
  • Li W; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, 610054, Chengdu, China.
  • Cheng X; Department of Materials Science and Engineering, The Pennsylvania State University, State College, PA, 16802, USA.
  • Zhou Y; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.
  • Yang S; Electronic Materials Research Lab, Key Lab of Education Ministry/International Center for Dielectric Research, School of Electronic and Information Engineering, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, 710049, Xi'an, China.
  • Zhang X; School of Materials Science and Engineering, Research Center for Materials Genome Engineering, Wuhan University of Technology, 430070, Wuhan, China.
  • Chen C; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, 610054, Chengdu, China.
  • Yang T; Department of Materials Science and Engineering, The Pennsylvania State University, State College, PA, 16802, USA. tuy123@psu.edu.
  • Pan H; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, 610054, Chengdu, China.
  • Xie G; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, 610054, Chengdu, China.
  • Chen G; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.
  • Zhao X; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.
  • Xiao X; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA.
  • Li B; School of Materials Science and Engineering, Research Center for Materials Genome Engineering, Wuhan University of Technology, 430070, Wuhan, China. libei@whut.edu.cn.
  • Tai H; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, 610054, Chengdu, China.
  • Jiang Y; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China, 610054, Chengdu, China.
  • Chen LQ; Department of Materials Science and Engineering, The Pennsylvania State University, State College, PA, 16802, USA.
  • Li F; Electronic Materials Research Lab, Key Lab of Education Ministry/International Center for Dielectric Research, School of Electronic and Information Engineering, State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, 710049, Xi'an, China. ful5@xjtu.edu.cn.
  • Chen J; Department of Bioengineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA. jun.chen@ucla.edu.
Nat Commun ; 13(1): 4867, 2022 08 18.
Article en En | MEDLINE | ID: mdl-35982033
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Texto completo: 1 Bases de datos: MEDLINE Asunto principal: Nanofibras Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2022 Tipo del documento: Article País de afiliación: China
Texto completo
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Texto completo: 1 Bases de datos: MEDLINE Asunto principal: Nanofibras Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2022 Tipo del documento: Article País de afiliación: China