Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System.

Kim, Tae Hyeong; Kang, Dongchan; Kim, Jeong Nyeon; Park, Ik Keun.

Afiliación

Kim TH; Graduate School of Energy and Environment, Seoul National University of Science and Technology, 232 Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea.
Kang D; SeoulTech NDT Research Center (SNDT), Seoul National University of Science and Technology, 232 Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea.
Kim JN; Edward L. Ginzton Laboratory, Stanford University, Stanford, CA 94305, USA.
Park IK; Department of Mechanical and Automotive Engineering, Seoul National University of Science and Technology, 232 Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea.

Materials (Basel) ; 16(2)2023 Jan 16.

Article en En | MEDLINE | ID: mdl-36676597