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Research on Dust Effect for MEMS Thermal Wind Sensors.
Yi, Zhenxiang; Wang, Yishan; Qin, Ming; Huang, Qingan.
Afiliación
  • Yi Z; Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China.
  • Wang Y; Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China.
  • Qin M; Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China.
  • Huang Q; Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096, China.
Sensors (Basel) ; 23(12)2023 Jun 13.
Article en En | MEDLINE | ID: mdl-37420700
ABSTRACT
This communication investigated the dust effect on microelectromechanical system (MEMS) thermal wind sensors, with an aim to evaluate performance in practical applications. An equivalent circuit was established to analyze the temperature gradient influenced by dust accumulation on the sensor's surface. The finite element method (FEM) simulation was carried out to verify the proposed model using COMSOL Multiphysics software. In experiments, dust was accumulated on the sensor's surface by two different methods. The measured results indicated that the output voltage for the sensor with dust on its surface was a little smaller than that of the sensor without dust at the same wind speed, which can degrade the measurement sensitivity and accuracy. Compared to the sensor without dust, the average voltage was reduced by about 1.91% and 3.75% when the dustiness was 0.04 g/mL and 0.12 g/mL, respectively. The results can provide a reference for the actual application of thermal wind sensors in harsh environments.
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Texto completo: 1 Bases de datos: MEDLINE Asunto principal: Polvo / Sistemas Microelectromecánicos Idioma: En Revista: Sensors (Basel) Año: 2023 Tipo del documento: Article País de afiliación: China

Texto completo: 1 Bases de datos: MEDLINE Asunto principal: Polvo / Sistemas Microelectromecánicos Idioma: En Revista: Sensors (Basel) Año: 2023 Tipo del documento: Article País de afiliación: China