RESUMO
Backing materials with tailored acoustic properties are beneficial for miniaturized ultrasonic transducer design. Whereas piezoelectric P(VDF-TrFE) films are common elements in high-frequency (>20 MHz) transducer design, their low coupling coefficient limits their sensitivity. Defining a suitable sensitivity-bandwidth trade-off for miniaturized high-frequency applications requires backings with impedances of >25 MRayl and strongly attenuating to account for miniaturized requirements. The motivation of this work is related to several medical applications such as small animal, skin or eye imaging. Simulations showed that increasing the acoustic impedance of the backing from 4.5 to 25 MRayl increases transducer sensitivity by 5 dB but decreases the bandwidth, which nevertheless remains high enough for the targeted applications. In this paper, porous sintered bronze material with spherically shaped grains, size-adapted for 25-30 MHz frequency, was impregnated with tin or epoxy resin to create multiphasic metallic backings. Microstructural characterizations of these new multiphasic composites showed that impregnation was incomplete and that a third air phase was present. The selected composites, sintered bronze-tin-air and sintered bronze-epoxy-air, at 5-35 MHz characterization, produced attenuation coefficients of 1.2 and >4 dB/mm/MHz and impedances of 32.4 and 26.4 MRayl, respectively. High-impedance composites were adopted as backing (thickness = 2 mm) to fabricate focused single-element P(VDF-TrFE)-based transducers (focal distance = 14 mm). The center frequency was 27 MHz, while the bandwidth at -6 dB was 65% for the sintered-bronze-tin-air-based transducer. We evaluated imaging performance using a pulse-echo system on a tungsten wire (diameter = 25 µm) phantom. Images confirmed the viability of integrating these backings in miniaturized transducers for imaging applications.
RESUMO
Insulating materials from the parylene family were investigated for use in low-power-consumption electrowetting-based liquid lenses. It was shown that for DC-driven operations, parylene C leads to hysteresis, regardless of the presence of a hydrophobic top coat. This hysteresis was attributed to the non-negligible time needed to reach a stable contact angle, due to charge injection and finite conductivity of the material. It was further demonstrated that by using materials with better insulating properties, such as parylene HT and VT4, satisfactory results can be obtained under DC voltages, reaching a low contact angle hysteresis of below 0.2°. We propose a simplified model that takes into account the injection of charges from both sides of the insulating material (the liquid side and the electrode side), showing that electrowetting response can be both increased and decreased.
RESUMO
An innovative processing to deposit P(VDF-TrFE) film on silicon wafers by an inkjet printing method was used to fabricate high-frequency annular array prototype. This prototype has a total aperture of 7.3 mm and 8 active elements. A polymer-based lens with low acoustic attenuation was added to the flat deposition on the wafer, setting the geometric focus to 13.8 mm. With a thickness of around 11 µm, the electromechanical performance of P(VDF-TrFE) films was evaluated with an effective thickness coupling factor of 22%. Electronics allowing all elements to simultaneously emit as a single element transducer was developed. In reception, a dynamic focusing, based on eight independent amplifying channels, was preferred. The center frequency of the prototype was 21.3 MHz, the insertion loss was 48.5 dB and the -6 dB fractional bandwidth was 143%. The trade-off sensitivity/bandwidth has rather favored the large bandwidth. Dynamic focusing on reception was applied and allowed to improvements in the lateral-full width at half maximum as shown on images obtained with a wire phantom at several depths. The next step, for a fully operational multi-element transducer, will be to achieve a significant increase of the acoustic attenuation in the silicon wafer.