RESUMO
Primarily used as an encapsulant and soft adhesive, Sylgard 184 is an engineered, high-performance silicone polymer that has applications spanning microfluidics, microelectromechanical systems, mechanobiology, and protecting electronic and non-electronic devices and equipment. Despite its ubiquity, there are improvements to be considered, namely, decreasing its gel point at room temperature, understanding volatile gas products upon aging, and determining how material properties change over its lifespan. In this work, these aspects were investigated by incorporating well-defined compounds (the Ashby-Karstedt catalyst and tetrakis (dimethylsiloxy) silane) into Sylgard 184 to make modified formulations. As a result of these additions, the curing time at room temperature was accelerated, which allowed for Sylgard 184 to be useful within a much shorter time frame. Additionally, long-term thermal accelerated aging was performed on Sylgard 184 and its modifications in order to create predictive lifetime models for its volatile gas generation and material properties.
RESUMO
We report moment distribution results from a laboratory experiment, similar in character to an isolated strike-slip earthquake fault, consisting of sheared elastic plates separated by a narrow gap filled with a two-dimensional granular medium. Local measurement of strain displacements of the plates at 203 spatial points located adjacent to the gap allows direct determination of the event moments and their spatial and temporal distributions. We show that events consist of spatially coherent, larger motions and spatially extended (noncoherent), smaller events. The noncoherent events have a probability distribution of event moment consistent with an M(-3/2) power law scaling with Poisson-distributed recurrence times. Coherent events have a log-normal moment distribution and mean temporal recurrence. As the applied normal pressure increases, there are more coherent events and their log-normal distribution broadens and shifts to larger average moment.