Low-power-consumption modulation of short-cavity DBR laser on SiO2/Si substrate.

We developed short-active-length distributed Bragg reflector (DBR) lasers to reduce the power consumption of chip-to-chip optical interconnects. These lasers have buried bulk InGaAsP waveguides to increase the coupling efficiency between the active region and DBR to 99.79% from the 98.14% of our previous DBR lasers that had InP channel waveguides. We achieved continuous wave operation of 5- to 80-µm active-length DBR lasers and the 5-µm-long laser consumed 24 fJ/bit with a 10-Gbps NRZ signal. The threshold current of the 5-µm laser was 51 µA, which compares favorably to our previous 10-µm DBR lasers with a threshold current of 170 µA.

Heterogeneously integrated widely tunable laser using lattice filter and ring resonator on Si photonics platform.

We fabricated a tunable laser consisting of a Si lattice filter, a Si ring resonator, and a III-V gain region. The lattice filter, a cascade of interferometers with the same delay length, has periodic transmission peaks with a wide free spectral range (FSR). By connecting the lattice filter to a ring resonator with a narrow FSR, the lasing mode is selected from one of the resonance modes of the ring resonator. The lasing wavelength can be tuned by changing the transmission peak wavelength of the lattice filter, in which an integrated micro heater controls the refractive index of the longer or shorter arm. Since the length of the refractive index control region on both arms of the lattice filter can be extended while maintaining a wide FSR, a wide tuning range can be obtained. This laser facilitates the control of the lasing wavelength because of the simple configuration. The Si lattice filter and the Si ring resonator were fabricated on a Si photonics platform by a Si photonics foundry, and III-V gain region was heterogeneously integrated. The lasing wavelength is shifted to a longer (shorter) one by heating the longer (shorter) arm of the lattice filter, in which the tuning wavelength is 1529 to 1561 nm and side-mode suppression ratio is more than 40 dB. A Lorentzian linewidth for lasing wavelengths narrower than 40 kHz is also demonstrated.

Integration of a high-efficiency Mach-Zehnder modulator with a DFB laser using membrane InP-based devices on a Si photonics platform.

We demonstrate a wafer-level integration of a distributed feedback laser diode (DFB LD) and high-efficiency Mach-Zehnder modulator (MZM) using InGaAsP phase shifters on Si waveguide circuits. The key to integrating materials with different bandgaps is to combine direct wafer bonding of a multiple quantum well layer for the DFB LD and regrowth of a bulk layer for the phase shifter. Buried regrowth of an InP layer is also employed to define the waveguide cores for the LD and phase shifters on a Si substrate. Both the LD and phase shifters have 230-nm-thick lateral diodes, whose thickness is less than the critical thickness of the III-V compound semiconductor layers on the Si substrate. The fabricated device has a 500-µm-long DFB LD and 500-µm-long carrier-depletion InGaAsP-bulk phase shifters, which provide a total footprint of only 1.9 × 0.31 mm2. Thanks to the low losses of the silica-based fiber couplers, InP/Si narrow tapers, and the phase shifters, the fiber-coupled output power of 3.2 mW is achieved with the LD current of 80 mA. The MZM has a VπL of around 0.4 Vcm, which overcomes the VπL limit of typical carrier-depletion Si MZMs. Thanks to the high modulation efficiency, the device shows an extinction ratio of 5 dB for 50-Gbit/s NRZ signal with a low peak-to-peak voltage of 2.5 V, despite the short phase shifters and single-arm driving.

Optical links on silicon photonic chips using ultralow-power consumption photonic-crystal lasers.

Ultrashort-distance optical interconnects are becoming increasingly important due to continuous improvements in servers and high-performance computers. As light sources in such interconnects, directly modulated semiconductor lasers with an ultrasmall active region are promising. In addition, using Si waveguides is important to provide low loss optical links with functions such as wavelength filtering and switching. In this paper, we demonstrate a wafer-scale heterogeneous integration of lambda-scale embedded active-region photonic-crystal (LEAP) lasers and Si waveguides, achieved through precise alignment. We numerically and experimentally demonstrated the coupling design between the LEAP lasers and Si waveguides; it is important to match propagation constants of Si waveguides and wavenumber of the optical cavity modes. The LEAP lasers exhibit an ultralow threshold current of 13.2-µA and 10-Gbit/s direct modulation. We also achieved the first data transmission using an optical link consisting of a LEAP laser, Si waveguide, and photodetector and obtained an averaged eye diagram at a bit rate of 10 Gbit/s with a bias current of 150 µA.

Membrane buried-heterostructure DFB laser with an optically coupled III-V/Si waveguide.

We have developed a membrane buried-heterostructure (BH) distributed feedback (DFB) laser consisting of an optically coupled III-V/Si waveguide and SiN surface grating. A 230-nm-thick membrane III-V layer enables us to construct an optical supermode in a 220-nm-thick Si waveguide and control the optical confinement factor in both the III-V and Si layers by changing Si waveguide width. This makes it possible to use a conventional Si photonics platform because the Si waveguides widely used on it are around 220-nm thick. To fabricate the BH-the key component for constructing a membrane laser with a lateral current-injection structure-we used direct wafer bonding and regrowth by metalorganic vapor phase epitaxy. Light output from the DFB laser is transferred to the Si waveguide through a short inverse-taper InP waveguide. A fiber-chip interface constructed by using inverse-taper Si waveguides and SiOx waveguides provides 2-dB fiber coupling loss. Fiber coupling power of 7.9 mW is obtained with a λ/4-shifted DFB laser with a 500-µm-long cavity. Single-mode lasing with a side-mode suppression ratio of 50 dB and lasing up to 120°C are also demonstrated.

Membrane InGaAsP Mach-Zehnder modulator with SiN:D waveguides on Si platform.

A high-efficiency InGaAsP Mach-Zehnder modulator is integrated with hydrogen-free deuterated silicon nitride (SiN:D) waveguide circuits on a Si substrate. A thin InP-based layer provides a high optical confinement factor of around 50% and enables easy optical coupling to the SiN:D waveguides, which are fabricated by a low-temperature backend process. The fabricated Mach-Zehnder modulator with a 300-µm-long phase shifter shows a VπL of 0.4 Vcm, insertion loss of ~4.5 dB, and an error-free operation for 40-Gbit/s non-return-to-zero signal.

Amplifierless PAM-4/PAM-8 transmissions in O-band using a directly modulated laser for optical data-center interconnects.

Toward the realization of low-cost, long-, and extended-reach 400GbE data-center applications, the performance of pulse amplitude modulated (PAM) signals is studied using a state-of-the-art, high-performance 1.3-µm distributed feedback directly modulated laser, without any optical amplification or complex digital processing. Amplifierless PAM-4 transmissions of up to 64-Gb/s are achieved over 40 km of standard single-mode fiber (SSMF) for standard KP4-FEC, while 84-Gb/s PAM-8 signals are evaluated over 10 km SSMF.

Twin-mirror membrane distributed-reflector lasers using 20-µm-long active region on Si substrates.

We demonstrate 20-µm-long twin-mirror membrane distributed-reflector (DR) lasers for chip-to-chip optical interconnects. The lasers employ distributed Bragg reflectors (DBRs) at both ends of a 20-µm-long λ/4-phase shifted distributed feedback (DFB) section. We achieve single-mode lasing in a λ/4-phase shifted DFB mode at room temperature with a threshold current of 0.39 mA. The lasing wavelength remains stable while the injected current is varied, and it is determined by the λ/4 phase-shifted DFB. The modulation current efficiency is 11.4 GHz/mA1/2, which is measured by using relative intensity noise spectra. We also demonstrate the direct modulation of the DR lasers at a bit rate of 25.8 Gbit/s with an energy cost of 163 fJ/bit.

Membrane distributed-reflector laser integrated with SiOx-based spot-size converter on Si substrate.

We demonstrate monolithic integration of a 50-µm-long-cavity membrane distributed-reflector laser with a spot-size converter, consisting of a tapered InP wire waveguide and an SiOx waveguide, on SiO2/Si substrate. The device exhibits 9.4-GHz/mA0.5 modulation efficiency with a 2.2-dB fiber coupling loss. We demonstrate 25.8-Gbit/s direct modulation with a bias current of 2.5 mA, resulting in a low energy cost of 132 fJ/bit.

Heterogeneously integrated photonic-crystal lasers on silicon for on/off chip optical interconnects.

We demonstrate the continuous-wave operation of lambda-scale embedded active-region photonic-crystal (LEAP) lasers at room temperature, which we fabricated on a Si wafer. The on-Si LEAP lasers exhibit a threshold current of 31 µA, which is the lowest reported value for any type of semiconductor laser on Si. This reveals the great potential of LEAP lasers as light sources for on- or off-chip optical interconnects with ultra-low power consumption in future information communication technology devices including CMOS processors.

Directly modulated buried heterostructure DFB laser on SiO2/Si substrate fabricated by regrowth of InP using bonded active layer.

We describe the growth of InP layer using an ultrathin III-V active layer that is directly bonded to SiO2/Si substrate to fabricate a buried heterostructure (BH) laser. Using a 250-nm-thick bonded active layer, we succeeded in fabricating a BH distributed feedback (DFB) laser on SiO2/Si substrate. The use of a lateral current injection structure is important for forming a p-i-n junction using bonded thin film. The fabricated DFB laser is directly modulated by a 25.8-Gbit/s NRZ signal at 50°C. These results indicate that our fabrication method is a promising way to fabricate high-efficiency lasers at a low cost.

Room-temperature continuous-wave operation of lateral current injection wavelength-scale embedded active-region photonic-crystal laser.

We have developed a wavelength-scale embedded active-region photonic-crystal laser using lateral p-i-n structure. Zn diffusion and Si ion implantation are used for p- and n-type doping. Room-temperature continuous-wave lasing behavior is clearly observed from the injection current dependence of the output power, 3dB-bandwidth of the peak, and lasing wavelength. The threshold current is 390 µA and the estimated effective threshold current is 9.4 µA. The output power in output waveguide is 1.82 µW for a 2.0-mA current injection. These results indicate that the embedded active-region structure effectively reduce the thermal resistance. Ultrasmall electrically driven lasers are an important step towards on-chip photonic network applications.

All-optical wavelength-routing switch with monolithically integrated filter-free tunable wavelength converters and an AWG.

We present a compact 4x8 wavelength-routing switch that monolithically integrates fast tunable wavelength converters (TWCs) and an arrayed-waveguide grating (AWG) for optical packet switching. The TWC consists of a double-ring-resonator-coupled tunable laser which allows rapid and stable switching, and an optical gate based on a parallel amplifier structure which prevents an input optical signal from being routed through the AWG (filter-free operation). A deep-ridge waveguide technology, employed for the AWG and ring resonators, facilitates the fabrication of the switch and makes the device compact. The filter-free TWCs achieve low crosstalk of the input optical signal of less than -22 dB. The wavelength routing operation of a non-return-to-zero (NRZ) signal at 10 Gbit/s is achieved with a switching time of less than 5 ns.

Dynamic switching characteristics of InGaAsP/InP multimode interference optical waveguide switch.

Multimode interference (MMI) waveguide switches show promise for switch in optical packet switching (OPS). In this work, we fabricated 1 x 4 InGaAsP/InP MMI waveguide switch device which consists of a 1 x 4 MMI splitter, 4 equally spaced single-mode waveguides with phase shifters, and a 4 x 4 MMI combiner. Good crosstalk and extinction ratio of -14.47 dB and 23.39 dB, respectively, are obtained. In addition, we experimentally demonstrate dynamic switching, and the rise and fall time of 1.4 ns and 1.2 ns, respectively, are obtained.

All-optical on-chip bit memory based on ultra high Q InGaAsP photonic crystal.

We demonstrate all-optical bit memory operation with photonic crystal (PhC) nanocavities based on an InGaAsP substrate with a band gap at a wavelength of about 1.3 microm. The optical bistability is based on a refractive index modulation caused by carrier-plasma dispersion. The operating energy required for switching is only 30 fJ, and the minimum optical bias power for bistability is 40 microW, which is about one hundred times less than that required for laser based bistable memories.