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Lead sulfide (PbS) colloidal quantum dots (CQDs) are promising materials for next-generation flexible solar cells because of near-infrared absorption, facile bandgap tunability, and superior air stability. However, CQD devices still lack enough flexibility to be applied to wearable devices owing to the poor mechanical properties of CQD films. In this study, a facile approach is proposed to improve the mechanical stability of CQDs solar cells without compromising the high power conversion efficiency (PCE) of the devices. (3-aminopropyl)triethoxysilane (APTS) is introduced on CQD films to strengthen the dot-to-dot bonding via QD-siloxane anchoring, and as a result, crack pattern analysis reveals that the treated devices become robust to mechanical stress. The device maintains 88% of the initial PCE under 12 000 cycles at a bending radius of 8.3 mm. In addition, APTS forms a dipole layer on CQD films, which improves the open circuit voltage (VOC ) of the device, achieving a PCE of 11.04%, one of the highest PCEs in flexible PbS CQD solar cells.
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Fracture toughness, which is the resistance of a material to crack propagation, is a critical material property for ensuring the mechanical reliability of damage-tolerant design. Recently, damage-tolerant design is introduced to flexible electronics by adopting micro-cracked ultra-thin nanocrystalline (NC) gold films as stretchable electrodes in a plane stress state. However, experimental investigation of the plane stress fracture toughness of those films remains challenging due to the intrinsic fragility from their sub-100 nm thicknesses. Here, a quantitative method for systematically evaluating the plane stress fracture toughness of freestanding ultra-thin NC gold film on water surface platform is presented. After effectively fabricating single-edge-notched-tension samples with femtosecond laser, mode I stress intensity factors are measured in the plane stress state on water surface. Moreover, investigation regarding the effect of notch length, notch sharpness, and notch tip plasticity validates this method based on linear elastic fracture mechanics theory. As a demonstration, the thickness-dependent plane stress fracture toughness of ultra-thin NC gold films is qualitatively unveiled. It is revealed that the thickness confinement effect on grain boundary sliding induces a transition in fracture behavior. This method is expected to further clarify the fracture-related properties of various ultra-thin films for next-generation electronics.
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Collagen is a prominent target of nonenzymatic glycation, which is a hallmark of aging and causes functional alteration of the matrix. Here, we uncover glycation-mediated structural and functional changes in the collagen-enriched meningeal membrane of the human and mouse brain. Using an in vitro culture platform mimicking the meningeal membrane composed of fibrillar collagen, we showed that the accumulation of advanced glycation end products (AGEs) in the collagen membrane is responsible for glycation-mediated matrix remodeling. These changes influence fibroblast-matrix interactions, inducing cell-mediated ECM remodeling. The adherence of meningeal fibroblasts to the glycated collagen membrane was mediated by the discoidin domain-containing receptor 2 (DDR2), whereas integrin-mediated adhesion was inhibited. A-kinase anchoring protein 12 (AKAP12)-positive meningeal fibroblasts in the meningeal membrane of aged mice exhibited substantially increased expression of DDR2 and depletion of integrin beta-1 (ITGB1). In the glycated collagen membrane, meningeal fibroblasts increased the expression of matrix metalloproteinase 14 (MMP14) and less tissue inhibitor of metalloproteinase-1 (TIMP1). In contrast, the cells exhibited decreased expression of type I collagen (COL1A1). These results suggest that glycation modification by meningeal fibroblasts is intimately linked to aging-related structural and functional alterations in the meningeal membrane.
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Reação de Maillard , Inibidor Tecidual de Metaloproteinase-1 , Camundongos , Humanos , Animais , Inibidor Tecidual de Metaloproteinase-1/metabolismo , Colágeno/metabolismo , Integrinas/metabolismo , Produtos Finais de Glicação Avançada/metabolismo , Encéfalo/metabolismo , Fibroblastos/metabolismo , Proteínas de Ciclo Celular/metabolismo , Proteínas de Ancoragem à Quinase A/metabolismoRESUMO
Transfer printing of inorganic thin-film semiconductors has attracted considerable attention to realize high-performance soft electronics on unusual substrates. However, conventional transfer technologies including elastomeric transfer printing, laser-assisted transfer, and electrostatic transfer still have challenging issues such as stamp reusability, additional adhesives, and device damage. Here, a micro-vacuum assisted selective transfer is reported to assemble micro-sized inorganic semiconductors onto unconventional substrates. 20 µm-sized micro-hole arrays are formed via laser-induced etching technology on a glass substrate. The vacuum controllable module, consisting of a laser-drilled glass and hard-polydimethylsiloxane micro-channels, enables selective modulation of micro-vacuum suction force on microchip arrays. Ultrahigh adhesion switchability of 3.364 × 106, accomplished by pressure control during the micro-vacuum transfer procedure, facilitates the pick-up and release of thin-film semiconductors without additional adhesives and chip damage. Heterogeneous integration of III-V materials and silicon is demonstrated by assembling microchips with diverse shapes and sizes from different mother wafers on the same plane. Multiple selective transfers are implemented by independent pressure control of two separate vacuum channels with a high transfer yield of 98.06%. Finally, flexible micro light-emitting diodes and transistors with uniform electrical/optical properties are fabricated via micro-vacuum assisted selective transfer.
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The thermomechanical behavior of a conjugated polymer (CP) in a thin film state has rarely been studied despite the importance of understanding the polymer morphologies and optimizing the thermal processes of organic semiconductors. Moreover, the seamless integration of multilayers without mechanical failures in CP-based electronic devices is crucial for determining their operational stability. Large differences in the coefficients of thermal expansion (CTEs) between the multilayers can cause serious degradation of devices under thermal stress. In this study, we measure the intrinsic thermomechanical properties of poly(3-hexylthiophene) (P3HT) thin films in a pseudo-freestanding state on the water surface. The as-cast P3HT thin films exhibited a large thermal shrinkage (-1001 ppm K-1) during heating on the water surface. Morphological analyses revealed that the thermal shrinkage of the polymer films was caused by the rearrangement of the polymer chain networks accompanied by crystallization, thus indicating that preheating the polymer films is essential for estimating their intrinsic CTE values. Moreover, the rigidity of the substrate significantly influences the thermomechanical behavior of the polymer films. The polymer films that were preheated on the glass substrate showed nonlinear thermal expansion due to the substrate constraint inhibiting sufficient relaxation of the polymer chains. In comparison, a linear expansion behavior is observed after preheating the films on the water surface, exhibiting a consistent CTE value (185 ppm K-1) regardless of the number of thermal strain measurements. Thus, this work provides a direct method for measuring in-plane CTE values and an in-depth understanding of the thermomechanical behaviors of CP thin films to design thermomechanically reliable organic semiconductors.
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Integration of rigid components in soft polymer matrix is considered as the most feasible architecture to enable stretchable electronics. However, a method of suppressing cracks at the interface between soft and rigid materials due to excessive and repetitive deformations of various types remains a formidable challenge. Here, we geometrically engineered Ferris wheel-shaped islands (FWIs) capable of effectively suppressing crack propagation at the interface under various deformation modes (stretching, twisting, poking, and crumpling). The optimized FWIs have notable increased strain at failure and fatigue life compared with conventional circle- and square-shaped islands. Stretchable electronics composed of various rigid components (LED and coin cell) were demonstrated using intrinsically stretchable printed electrodes. Furthermore, electronic skin capable of differentiating various tactile stimuli without interference was demonstrated. Our method enables stretchable electronics that can be used under various geometrical forms with notable enhanced durability, enabling stretchable electronics to withstand potentially harsh conditions of everyday usage.
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Flexible and mechanically robust gas sensors are the key technologies for wearable and implantable electronics. Herein, the authors demonstrate the high-performance, flexible nitrogen dioxide (NO2 ) chemiresistors using a series of n-type conjugated polymers (CPs: PNDIT2/IM-x) and a polymer dopant (poly(ethyleneimine), PEI). Imine double bonds (C = N) are incorporated into the backbones of the CPs with different imine contents (x) to facilitate strong and selective interactions with NO2 . The PEI provides doping stability, enhanced electrical conductivity, and flexibility. As a result, the NO2 sensors with PNDIT2/IM-0.1 and PEI (1:1 by weight ratio) exhibit outstanding sensing performances, such as excellent sensitivity (ΔR/Rb = 240% @ 1 ppm), ultralow detection limit (0.1 ppm), high selectivity (ΔR/Rb < 8% @ 1 ppm of interfering analytes), and high stability, thereby outperforming other state-of-the-art CP-based chemiresistors. Furthermore, the thin film of PNDIT2/IM-0.1 and PEI blend is stretchable and mechanically robust, providing excellent flexibility to the NO2 sensors. Our study contributes to the rational design of high-performance flexible gas sensors.
Assuntos
Dióxido de Nitrogênio , Polímeros , Condutividade Elétrica , Eletrônica , Iminas , Polímeros/químicaRESUMO
The development of small-molecule acceptors (SMAs) has significantly enhanced the power conversion efficiency (PCE) of polymer solar cells (PSCs); however, the inferior mechanical properties of SMA-based PSCs often limit their long-term stability and application in wearable power generators. Herein, we demonstrate a simple and effective strategy for enhancing the mechanical robustness and PCE of PSCs by incorporating a high-molecular-weight (MW) polymer acceptor (P A, P(NDI2OD-T2)). The addition of 10-20 wt % P A leads to a more than 4-fold increase in the mechanical ductility of the SMA-based PSCs in terms of the crack onset strain (COS). At the same time, the incorporation of P A into the active layer improves the charge transport and recombination properties, increasing the PCE of the PSC from 14.6 to 15.4%. The added P As act as tie molecules, providing mechanical and electrical bridges between adjacent domains of SMAs. Thus, for the first time, we produce highly efficient and mechanically robust PSCs with a 15% PCE and 10% COS at the same time, thereby demonstrating their great potential as stretchable or wearable power generators. To understand the origin of the dual enhancements realized by P A, we investigate the influence of the P A content on electrical, structural, and morphological properties of the PSCs.
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For enhancing the performance and long-term stability of perovskite solar cell (PSC) devices, interfacial engineering between the perovskite and hole-transporting material (HTM) is important. We developed a fluorinated conjugated polymer PFPT3 and used it as an interfacial layer between the perovskite and HTM layers in normal-type PSCs. Interaction of perovskite and PFPT3 via Pb-F bonding effectively induces an interfacial dipole moment, which resulted in energy-level bending; this was favorable for charge transfer and hole extraction at the interface. The PSC device achieved an increased efficiency of 22.00% with an open-circuit voltage of 1.13 V, short-circuit current density of 24.34 mA/cm2, and fill factor of 0.80 from a reverse scan and showed an averaged power conversion efficiency of 21.59%, which was averaged from forward and reverse scans. Furthermore, the device with PFPT3 showed much improved stability under an 85% RH condition because hydrophobic PFPT3 reduced water permeation into the perovskite layer, and more importantly, the enhanced contact adhesion at the PFPT3-mediated perovskite/HTM interface suppressed surface delamination and retarded water intrusion. The fluorinated conjugated polymeric interfacial material is effective for improving not only the efficiency but also the stability of the PSC devices.
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Electronic skins (e-skins)-electronic sensors mechanically compliant to human skin-have long been developed as an ideal electronic platform for noninvasive human health monitoring. For reliable physical health monitoring, the interface between the e-skin and human skin must be conformal and intact consistently. However, conventional e-skins cannot perfectly permeate sweat in normal day-to-day activities, resulting in degradation of the intimate interface over time and impeding stable physical sensing. Here, we present a sweat pore-inspired perforated e-skin that can effectively suppress sweat accumulation and allow inorganic sensors to obtain physical health information without malfunctioning. The auxetic dumbbell through-hole patterns in perforated e-skins lead to synergistic effects on physical properties including mechanical reliability, conformability, areal mass density, and adhesion to the skin. The perforated e-skin allows one to laminate onto the skin with consistent homeostasis, enabling multiple inorganic sensors on the skin to reliably monitor the wearer's health over a period of weeks.
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Stretchable organic light-emitting diodes are ubiquitous in the rapidly developing wearable display technology. However, low efficiency and poor mechanical stability inhibit their commercial applications owing to the restrictions generated by strain. Here, we demonstrate the exceptional performance of a transparent (molybdenum-trioxide/gold/molybdenum-trioxide) electrode for buckled, twistable, and geometrically stretchable organic light-emitting diodes under 2-dimensional random area strain with invariant color coordinates. The devices are fabricated on a thin optical-adhesive/elastomer with a small mechanical bending strain and water-proofed by optical-adhesive encapsulation in a sandwiched structure. The heat dissipation mechanism of the thin optical-adhesive substrate, thin elastomer-based devices or silicon dioxide nanoparticles reduces triplet-triplet annihilation, providing consistent performance at high exciton density, compared with thick elastomer and a glass substrate. The performance is enhanced by the nanoparticles in the optical-adhesive for light out-coupling and improved heat dissipation. A high current efficiency of ~82.4 cd/A and an external quantum efficiency of ~22.3% are achieved with minimum efficiency roll-off.
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Herein, a novel stretchable Cu conductor with excellent conductivity and stretchability is reported via the flash-induced multiscale tuning of Cu and an elastomer interface. Microscale randomly wrinkled Cu (amplitude of ≈5â µm and wavelength of ≈45 µm) is formed on a polymer substrate through a single pulse of a millisecond flash light, enabling the elongation of Cu to exceed 20% regardless of the stretching direction. The nanoscale interlocked interface between the Cu nanoparticles (NPs) and the elastomer increases the adhesion force of Cu, which contributes to a significant improvement of the Cu stability and stretchability under harsh yielding stress. Simultaneously, the flash-induced photoreduction of CuO NPs and subsequent Cu NP welding lead to outstanding conductivity (≈37 kS cm-1) of the buckled elastic electrode. The 3D structure of randomly wrinkled Cu is modeled by finite element analysis simulations to show that the flash-activated stretchable Cu conductors can endure strain over 20% in all directions. Finally, the wrinkled Cu is utilized for wireless near-field communication on the skin of human wrist.