Light-Induced Topological Patterning toward 3D Shape-Reconfigurable Origami.

Shape-reconfigurable materials are crucial in many engineering applications. However, because of their isotropic deformability, they often require complex molding equipment for shaping. A polymeric origami structure that follows predetermined deformed and non-deformed patterns at specific temperatures without molding is demonstrated. It is constructed with a heterogeneous (dynamic and static) network topology via light-induced programming. The corresponding spatio-selective thermal plasticity creates varied deformability within a single polymer. The kinematics of site-specific deformation allows guided origami deployment in response to external forces. Moreover, the self-locking origami can fix its geometry in specific states without pressurization. These features enable the development of shape-reconfigurable structures that undergo on-demand geometry changes without requiring bulky or heavy equipment. The concept enriches polymer origamis, and could be applied with other polymers having similar chemistries. Overall, it is a versatile material for artificial muscles, origami robotics, and non-volatile mechanical memory devices.

Creep Crack Growth Behavior during Hot Water Immersion of an Epoxy Adhesive Using a Spring-Loaded Double Cantilever Beam Test Method.

Double cantilever beam (DCB) tests were conducted by immersing the specimens in temperature-controlled water while applying a creep load using a spring. By introducing a data reduction scheme to the spring-loaded DCB test method, it was confirmed that only a single parameter measurement was sufficient to calculate the energy release rate (ERR). Aluminum alloy substrates bonded with an epoxy adhesive were used, and DCB tests were performed by changing the initial load values, spring constants, and immersion temperatures for two types of surface treatment. The initial applied load and spring constant had no effect on the ERR threshold. In contrast, the threshold decreased with the increasing immersion temperature, but even in the worst case, it was 15% of the critical ERR in the static tests. Using the creep crack growth relationship, it was revealed that there were three phases of creep immersion crack growth in the adhesive joints, and each phase was affected by the temperature. The spring-loaded DCB test method has great potential for investigating the combined effects of creep, moisture, and temperature, and this study has demonstrated the validity of the test method. The long-term durability of adhesive joints becomes increasingly important, and this test method is expected to become widespread.

Effect of Bond-Line Thickness on Fatigue Crack Growth of Structural Acrylic Adhesive Joints.

With an increasing demand for adhesives, the durability of joints has become highly important. The fatigue resistance of adhesives has been investigated mainly for epoxies, but in recent years many other resins have been adopted for structural adhesives. Therefore, understanding the fatigue characteristics of these resins is also important. In this study, the cyclic fatigue behavior of a two-part acrylic-based adhesive used for structural bonding was investigated using a fracture-mechanics approach. Fatigue tests for mode I loading were conducted under displacement control using double cantilever beam specimens with varying bond-line thicknesses. When the fatigue crack growth rate per cycle, da/dN, reached 10-5 mm/cycle, the fatigue toughness reduced to 1/10 of the critical fracture energy. In addition, significant changes in the characteristics of fatigue crack growth were observed varying the bond-line thickness and loading conditions. However, the predominance of the adhesive thickness on the fatigue crack growth resistance was confirmed regardless of the initial loading conditions. The thicker the adhesive bond line, the greater the fatigue toughness.