Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish.

Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method. The surface roughness of the EPIG was 82 nm, which was 1.6 times higher than that of the ENEPIG surface finish because the EPIG was so thin that it could not flatten rough bare Cu pads. From the cross-sectional SEM micrographs, the filler trapping of the TC-bonded EPIG was much higher than that of the ENEPIG sample. The high filler trapping of the EPIG sample was due to the high surface roughness of the EPIG surface finish. The contact resistance increased as the thermal cycle time increased. The increase of the contact resistance with 1500 cycles of the thermal cycle test was 26% higher for the EPIG sample than for the ENEPIG sample.

In-situ electrical conductivity measurement of oxidation of tin nanocluster film.

An in-situ electrical conductivity measurement of thin films of tin oxide nanoclusters for nano-devices was performed during metal cluster deposition and subsequent oxidation. From the current observation, the percolation threshold and the oxidation process are suggested. During baking at 200 degrees C, tin nanoclusters were transformed into low-conductivity stannous oxide and then into high-conductivity stannic oxide. From electron micrographs, it is suggested that the baking procedure is responsible for changing the oxide state and/or the crystallinity of the individual nanoclusters rather than changing the morphology of the film.

Enhancement of dielectric performance of encapsulation in barium titanate oxide using size-controlled reduced graphene oxide.

Ferroelectric barium titanate (BTO) powder particles were encapsulated by three different sizes of reduced graphene oxide (rGO) platelets. The size of the graphene oxide (GO) platelets is controlled by varying the horn type ultrasonic times, i.e. 0, 30, and 60 min, respectively, and they are reduced with hydrazine to obtain rGO-encapsulated BTO (rGO@BTO) film. The rGO@BTO film exhibits an increase in the dielectric characteristics due to the interfacial polarization. These improved characteristics include a dielectric constant of 194 (a large increment of 111%), along with the dielectric loss of 0.053 (a slight increment of 13%) at 1 kHz, compared to the pure BTO dielectric film. The improvement in the dielectric constant of the rGO@BTO is attributed to the encapsulation degree between the rGO platelets and BTO powder particles, which results in the interfacial polarization and micro-capacitor effect in a dielectric film, and also contributes to a low dielectric loss. Therefore, a suitable size of rGO platelets for encapsulation is essential for high-dielectric performance.