Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions.

Singla, Saranshu; Amarpuri, Gaurav; Dhopatkar, Nishad; Blackledge, Todd A; Dhinojwala, Ali

Singla, Saranshu; Amarpuri, Gaurav; Dhopatkar, Nishad; Blackledge, Todd A; Dhinojwala, Ali.

Afiliação

Singla S; Department of Polymer Science, The University of Akron, Akron, OH, 44325, United States.
Amarpuri G; Department of Polymer Science, The University of Akron, Akron, OH, 44325, United States.
Dhopatkar N; Eastman Chemical Company, Corporate Analytical Division, Kingsport, TN, 37662, United States.
Blackledge TA; Department of Polymer Science, The University of Akron, Akron, OH, 44325, United States.
Dhinojwala A; Avery Dennison Polymers, Adhesives and Coatings Center of Excellence, Mill Hall, PA, 17751, United States.

Nat Commun ; 9(1): 1890, 2018 05 22.

Article em En | MEDLINE | ID: mdl-29789602

Texto completo

Imprimir

XML

PubMed Links

Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: Nat Commun Assunto da revista: BIOLOGIA / CIENCIA Ano de publicação: 2018 Tipo de documento: Article País de afiliação: Estados Unidos

Texto completo

Imprimir

XML

PubMed Links

Buscar no Google