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Volume Shrinkage-Induced Voiding Mechanism During Electromigration of Cu/Ni/Sn-Ag Microbump.
Son, Kirak; Park, Gyu-Tae; Lee, Byeong-Rok; Park, Young-Bae.
Afiliação
  • Son K; School of Materials Science and Engineering, Andong National University, Andong-si 36729, Korea.
  • Park GT; Amkor Technology Korea Inc., Gwangju 61006, Korea.
  • Lee BR; STATS ChipPAC Korea Ltd., Incheon 22379, Korea.
  • Park YB; School of Materials Science and Engineering, Andong National University, Andong-si 36729, Korea.
J Nanosci Nanotechnol ; 20(1): 278-284, 2020 01 01.
Article em En | MEDLINE | ID: mdl-31383167
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: J Nanosci Nanotechnol Ano de publicação: 2020 Tipo de documento: Article
Texto completo
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XML
PubMed Links
Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: J Nanosci Nanotechnol Ano de publicação: 2020 Tipo de documento: Article