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Wirelessly controlled, bioresorbable drug delivery device with active valves that exploit electrochemically triggered crevice corrosion.
Koo, Jahyun; Kim, Sung Bong; Choi, Yeon Sik; Xie, Zhaoqian; Bandodkar, Amay J; Khalifeh, Jawad; Yan, Ying; Kim, Hojun; Pezhouh, Maryam Kherad; Doty, Karen; Lee, Geumbee; Chen, Yu-Yu; Lee, Seung Min; D'Andrea, Dominic; Jung, Kimin; Lee, KunHyuck; Li, Kan; Jo, Seongbin; Wang, Heling; Kim, Jae-Hwan; Kim, Jeonghyun; Choi, Sung-Geun; Jang, Woo Jin; Oh, Yong Suk; Park, Inkyu; Kwak, Sung Soo; Park, Ji-Hyeon; Hong, Doosun; Feng, Xue; Lee, Chi-Hwan; Banks, Anthony; Leal, Cecilia; Lee, Hyuck Mo; Huang, Yonggang; Franz, Colin K; Ray, Wilson Z; MacEwan, Matthew; Kang, Seung-Kyun; Rogers, John A.
Afiliação
  • Koo J; School of Biomedical Engineering, Korea University, Seoul 02841, Republic of Korea.
  • Kim SB; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Choi YS; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Xie Z; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Bandodkar AJ; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Khalifeh J; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Yan Y; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, China.
  • Kim H; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Pezhouh MK; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Doty K; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA.
  • Lee G; Department of Neurological Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA.
  • Chen YY; Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Lee SM; Center for Biomaterials, Biomedical Research Institute, Korea Institute of Science and Technology (KIST), Seoul 02792, Republic of Korea.
  • D'Andrea D; Feinberg School of Medicine, Northwestern University, Evanston, IL 60208, USA.
  • Jung K; Department of Comparative Biosciences Histology Service Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Lee K; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Li K; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Jo S; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Wang H; Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea.
  • Kim JH; Regenerative Neurorehabilitation Laboratory, Shirley Ryan Ability Lab, Chicago, IL 60611, USA.
  • Kim J; Department of Materials Science and Engineering, Korea Advanced Institute of Science Technology, Daejeon 34141, Republic of Korea.
  • Choi SG; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Jang WJ; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Oh YS; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Park I; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Kwak SS; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Park JH; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Hong D; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Feng X; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Lee CH; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Banks A; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Leal C; Department of Electronics Convergence Engineering, Kwangwoon University, Nowon-gu, Seoul 01897, Republic of Korea.
  • Lee HM; Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea.
  • Huang Y; Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  • Franz CK; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
  • Ray WZ; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
  • MacEwan M; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
  • Kang SK; Department of Materials Science Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Rogers JA; Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA.
Sci Adv ; 6(35): eabb1093, 2020 08.
Article em En | MEDLINE | ID: mdl-32923633
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Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Guideline Idioma: En Revista: Sci Adv Ano de publicação: 2020 Tipo de documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Guideline Idioma: En Revista: Sci Adv Ano de publicação: 2020 Tipo de documento: Article