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Abnormal In-Plane Thermomechanical Behavior of Two-Dimensional Hybrid Organic-Inorganic Perovskites.
Kim, Doyun; Vasileiadou, Eugenia S; Spanopoulos, Ioannis; Kanatzidis, Mercouri G; Tu, Qing.
Afiliação
  • Kim D; Department of Materials Science & Engineering, Texas A&M University, College Station, Texas77840, United States.
  • Vasileiadou ES; Department of Chemistry, Northwestern University, Evanston, Illinois60201, United States.
  • Spanopoulos I; Department of Chemistry, Northwestern University, Evanston, Illinois60201, United States.
  • Kanatzidis MG; Department of Chemistry, University of South Florida, Tampa, Florida33620, United States.
  • Tu Q; Department of Chemistry, Northwestern University, Evanston, Illinois60201, United States.
ACS Appl Mater Interfaces ; 15(6): 7919-7927, 2023 Feb 15.
Article em En | MEDLINE | ID: mdl-36740778
ABSTRACT
The implementation of two-dimensional (2D) hybrid organic-inorganic perovskites (HOIPs) in semiconductor device applications will have to accommodate the co-existence of strain and temperature stressors and requires a thorough understanding of the thermomechanical behavior of 2D HOIPs. This will mitigate thermomechanical stability issues and improve the durability of the devices, especially when one considers the high susceptibility of 2D HOIPs to temperature due to their soft nature. Here, we employ atomic force microscopy (AFM) stretching of suspended membranes to measure the temperature dependence of the in-plane Young's modulus (E∥) of model Ruddlesden-Popper 2D HOIPs with a general formula of (CH3(CH2)3NH3)2(CH3NH3)n-1PbnI3n+1 (here, n = 1, 3, or 5). We find that E∥ values of these 2D HOIPs exhibit a prominent non-monotonic dependence on temperature, particularly an abnormal thermal stiffening behavior (nearly 40% change in E∥) starting around the order-disorder transition temperature of the butylammonium spacer molecules, which is significantly different from the thermomechanical behavior expected from their 3D counterpart (CH3NH3PbI3) or other low-dimensional material systems. Further raising the temperature eventually reverses the trend to thermal softening. The magnitude of the thermally induced change in E∥ is also much higher in 2D HOIPs than in their 3D analogs. Our results can shed light on the structural origin of the thermomechanical behavior and provide needed guidance to design 2D HOIPs with desired thermomechanical properties to meet the application needs.
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos

Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos