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Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devices.
Yoo, Seonggwang; Yang, Tianyu; Park, Minsu; Jeong, Hyoyoung; Lee, Young Joong; Cho, Donghwi; Kim, Joohee; Kwak, Sung Soo; Shin, Jaeho; Park, Yoonseok; Wang, Yue; Miljkovic, Nenad; King, William P; Rogers, John A.
Afiliação
  • Yoo S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Yang T; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Park M; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.
  • Jeong H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Lee YJ; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Cho D; Department of Electrical and Computer Engineering, University of California, Davis, CA, 95616, USA.
  • Kim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Kwak SS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Shin J; Thin Film Materials Research Center, Korea Research Institute of Chemical Technology, Daejeon, 34114, Republic of Korea.
  • Park Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Wang Y; Bionics Research Center of Biomedical Research Division, Korea Institute of Science and Technology, Seoul, 02792, Republic of Korea.
  • Miljkovic N; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • King WP; Bionics Research Center of Biomedical Research Division, Korea Institute of Science and Technology, Seoul, 02792, Republic of Korea.
  • Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Nat Commun ; 14(1): 1024, 2023 02 23.
Article em En | MEDLINE | ID: mdl-36823288
ABSTRACT
Soft, wireless physiological sensors that gently adhere to the skin are capable of continuous clinical-grade health monitoring in hospital and/or home settings, of particular value to critically ill infants and other vulnerable patients, but they present risks for injury upon thermal failure. This paper introduces an active materials approach that automatically minimizes such risks, to complement traditional schemes that rely on integrated sensors and electronic control circuits. The strategy exploits thin, flexible bladders that contain small volumes of liquid with boiling points a few degrees above body temperature. When the heat exceeds the safe range, vaporization rapidly forms highly effective, thermally insulating structures and delaminates the device from the skin, thereby eliminating any danger to the skin. Experimental and computational thermomechanical studies and demonstrations in a skin-interfaced mechano-acoustic sensor illustrate the effectiveness of this simple thermal safety system and suggest its applicability to nearly any class of skin-integrated device technology.
Assuntos

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Pele / Eletrônica Limite: Humans Idioma: En Revista: Nat Commun Assunto da revista: BIOLOGIA / CIENCIA Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Pele / Eletrônica Limite: Humans Idioma: En Revista: Nat Commun Assunto da revista: BIOLOGIA / CIENCIA Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos