Thermal stress-assisted formation of submicron pillars from a thin film of CoCrCuFeNi high entropy alloy: experiments and simulations.

Yoon, Sungmin; Kimura, Yasuhiro; Gu, Shaojie; Toku, Yuhki; Ju, Yang; Cui, Yi.

Afiliação

Yoon S; Department of Micro-Nano Mechanical Science and Engineering, Nagoya University Furo-cho, Chikusa-ku Nagoya 464-8603 Japan ju@mech.nagoya-u.ac.jp.
Kimura Y; Department of Micro-Nano Mechanical Science and Engineering, Nagoya University Furo-cho, Chikusa-ku Nagoya 464-8603 Japan ju@mech.nagoya-u.ac.jp.
Gu S; Department of Micro-Nano Mechanical Science and Engineering, Nagoya University Furo-cho, Chikusa-ku Nagoya 464-8603 Japan ju@mech.nagoya-u.ac.jp.
Toku Y; Department of Micro-Nano Mechanical Science and Engineering, Nagoya University Furo-cho, Chikusa-ku Nagoya 464-8603 Japan ju@mech.nagoya-u.ac.jp.
Ju Y; Department of Micro-Nano Mechanical Science and Engineering, Nagoya University Furo-cho, Chikusa-ku Nagoya 464-8603 Japan ju@mech.nagoya-u.ac.jp.
Cui Y; Department of Mechanical Systems Engineering, Nagoya University Furo-cho, Chikusa-ku Nagoya city Aichi 464-8603 Japan yi.cui@mae.nagoya-u.ac.jp.

RSC Adv ; 13(41): 28513-28526, 2023 Sep 26.

Article em En | MEDLINE | ID: mdl-37780741

Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: RSC Adv Ano de publicação: 2023 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: RSC Adv Ano de publicação: 2023 Tipo de documento: Article