Your browser doesn't support javascript.
loading
Robust Pixel Design Methodologies for a Vertical Avalanche Photodiode (VAPD)-Based CMOS Image Sensor.
Inoue, Akito; Torazawa, Naoki; Yamada, Shota; Sugiura, Yuki; Ishii, Motonori; Sakata, Yusuke; Kunikyo, Taiki; Tamaru, Masaki; Kasuga, Shigetaka; Yuasa, Yusuke; Kitajima, Hiromu; Koshida, Hiroshi; Kabe, Tatsuya; Usuda, Manabu; Takemoto, Masato; Nose, Yugo; Okino, Toru; Shirono, Takashi; Nakanishi, Kentaro; Hirose, Yutaka; Koyama, Shinzo; Mori, Mitsuyoshi; Sawada, Masayuki; Odagawa, Akihiro; Tanaka, Tsuyoshi.
Afiliação
  • Inoue A; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Torazawa N; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Yamada S; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Sugiura Y; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Ishii M; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Sakata Y; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Kunikyo T; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Tamaru M; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Kasuga S; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Yuasa Y; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Kitajima H; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Koshida H; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Kabe T; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Usuda M; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Takemoto M; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Nose Y; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Okino T; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Shirono T; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Nakanishi K; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Hirose Y; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Koyama S; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Mori M; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Sawada M; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Odagawa A; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
  • Tanaka T; Panasonic Industry Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi 571-8506, Osaka, Japan.
Sensors (Basel) ; 24(16)2024 Aug 21.
Article em En | MEDLINE | ID: mdl-39205107
ABSTRACT
We present robust pixel design methodologies for a vertical avalanche photodiode-based CMOS image sensor, taking account of three critical practical factors (i) "guard-ring-free" pixel isolation layout, (ii) device characteristics "insensitive" to applied voltage and temperature, and (iii) stable operation subject to intense light exposure. The "guard-ring-free" pixel design is established by resolving the tradeoff relationship between electric field concentration and pixel isolation. The effectiveness of the optimization strategy is validated both by simulation and experiment. To realize insensitivity to voltage and temperature variations, a global feedback resistor is shown to effectively suppress variations in device characteristics such as photon detection efficiency and dark count rate. An in-pixel overflow transistor is also introduced to enhance the resistance to strong illumination. The robustness of the fabricated VAPD-CIS is verified by characterization of 122 different chips and through a high-temperature and intense-light-illumination operation test with 5 chips, conducted at 125 °C for 1000 h subject to 940 nm light exposure equivalent to 10 kLux.
Palavras-chave

Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: Sensors (Basel) Ano de publicação: 2024 Tipo de documento: Article País de afiliação: Japão

Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: Sensors (Basel) Ano de publicação: 2024 Tipo de documento: Article País de afiliação: Japão