Numerical Design of a Thread-Optimized Gripping System for Lap Joint Testing in a Split Hopkinson Apparatus.

Currently, few experimental methods exist that enable the mechanical characterization of adhesives under high strain rates. One such method is the Split Hopkinson Bar (SHB) test. The mechanical characterization of adhesives is performed using different specimen configurations, such as Single Lap Joint (SLJ) specimens. A gripping system, attached to the bars through threading, was conceived to enable the testing of SLJs. An optimization study for selecting the best thread was performed, analyzing the thread type, the nominal diameter, and the thread pitch. Afterwards, the gripping system geometry was numerically evaluated. The optimal threaded connection for the specimen consists of a trapezoidal thread with a 14 mm diameter and a 2 mm thread pitch. To validate the gripping system, the load-displacement (P-δ) curve of an SLJ, which was simulated as if it were tested on the SHB apparatus, was compared with an analogous curve from a validated drop-weight test numerical model.

Impact of in vitro findings on clinical protocols for the adhesion of CAD-CAM blocks: A systematic integrative review and meta-analysis.

STATEMENT OF PROBLEM: Computer-aided design and computer-aided manufacturing (CAD-CAM) blocks have evolved rapidly, making it difficult to establish the best clinical protocol for bonding a given block and whether an established protocol is appropriate for a newly introduced product. PURPOSE: This integrative systematic review and meta-analysis aimed to clarify whether the clinician can select the most efficient adhesion protocols for CAD-CAM blocks by reading published in vitro studies and implementing them in daily practice. MATERIAL AND METHODS: Based on the population, intervention, comparison, and outcome (PICO) strategy, 3 databases were searched for in vitro studies, randomized clinical trials, prospective or retrospective studies, and case reports from January 1, 2015, to July 31, 2021. A meta-analysis analyzed 28 studies to calculate the mean difference between best and worst protocols for each author and block with a random-effects model (α=.05). RESULTS: From 508 relevant studies, 37 in vitro studies, 2 clinical studies, and 1 clinical report were selected for data extraction and qualitative analysis. Vita Enamic, IPS e.max CAD, LAVA Ultimate, and Vita Mark II blocks were the most studied, and RelyX Ultimate was the most used luting cement. The meta-analysis confirmed the null hypothesis that the evidence-based efficacy of clinical protocols to bond CAD-CAM blocks is still controversial (P<.05). CONCLUSIONS: There are objective standards for individual in vitro tests, but the studies lack standardization. Some tested protocols were more efficient than others. Randomized clinical trials and well-documented clinical situations were almost nonexistent, making direct application of in vitro findings in clinical practice impossible.

The Mechanical Response of a Structural Epoxy Adhesive Reinforced with Carbon Black Nanoparticles.

The influence of the concentration of carbon black nanoparticles on the mechanical behavior of a structural adhesive was studied to evaluate and understand the stiffness, strength, and deformation behavior of a reinforced epoxy adhesive. Two carbon black nanoparticles with different dielectric properties and sizes (Monarch® 120 and Vulcan® XC72R) were studied. A bi-component structural epoxy adhesive was selected. Specimens with different concentrations of carbon black were manufactured (0, 5, 10, and 20% on volume of resin) for each type of nanoparticle. The specimens were cured in a hydraulic hot-plates press machine. The mechanical behavior of the adhesives was found not to vary significantly as a function of carbon black nanoparticles amount. A scanning electron microscopy analysis was performed to evaluate the fracture surface. The fracture surfaces of specimens were correlated with the mechanical response obtained through tensile tests.

Study of CFRP Laminate Gradually Modified throughout the Thickness Using Thin Ply under Transvers Tensile Loading.

The use of thin-ply composite materials has rapidly increased due to their tailorable mechanical properties and design flexibility. Considering an adhesively bonded composite joint, peel stress stands out as a key contributor leading to failure among other primary stress factors. Therefore, the reinforcement of carbon fiber-reinforced polymer (CFRP) laminates throughout the thickness could be considered as an approach to improve the joint strength. Using thin plies locally between the conventional CFRP layers in a laminate can enhance the strength, as the sudden change in stiffness means that the load transfer is not monotonous. Consequently, the following study examined the effect of altering thin plies gradually throughout the thickness on the behaviour of the CFRP laminates when subjected to transverse tensile loading. To achieve this goal, the CFRP laminates were gradually modified by using different commercially accessible prepreg thin plies, leading to an improved overall structural performance by reducing stress concentrations. Besides conducting an experimental study, a numerical assessment was also carried out utilizing Abaqus software with a Representative Volume Element (RVE) at the micro scale. The comparison of reference configurations, which involved various thin plies with different thicknesses and traditional CFRP laminates, with the suggested gradual configuration, demonstrated a notable enhancement in both strength and material cost. Furthermore, the proposed RVE model showed promising capability in accurately forecasting the strength of fabricated laminates.

Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach.

Examining crack propagation at the interface of bimaterial components under various conditions is essential for improving the reliability of semiconductor designs. However, the fracture behavior of bimaterial interfaces has been relatively underexplored in the literature, particularly in terms of numerical predictions. Numerical simulations offer vital insights into the evolution of interfacial damage and stress distribution in wafers, showcasing their dependence on material properties. The lack of knowledge about specific interfaces poses a significant obstacle to the development of new products and necessitates active remediation for further progress. The objective of this paper is twofold: firstly, to experimentally investigate the behavior of bimaterial interfaces commonly found in semiconductors under quasi-static loading conditions, and secondly, to determine their respective interfacial cohesive properties using an inverse cohesive zone modeling approach. For this purpose, double cantilever beam specimens were manufactured that allow Mode I static fracture analysis of the interfaces. A compliance-based method was used to obtain the crack size during the tests and the Mode I energy release rate (GIc). Experimental results were utilized to simulate the behavior of different interfaces under specific test conditions in Abaqus. The simulation aimed to extract the interfacial cohesive contact properties of the studied bimaterial interfaces. These properties enable designers to predict the strength of the interfaces, particularly under Mode I loading conditions. To this extent, the cohesive zone modeling (CZM) assisted in defining the behavior of the damage propagation through the bimaterial interfaces. As a result, for the silicon-epoxy molding compound (EMC) interface, the results for maximum strength and GIc are, respectively, 26 MPa and 0.05 N/mm. The second interface tested consisted of polyimide and silicon oxide between the silicon and EMC layers, and the results obtained are 21.5 MPa for the maximum tensile strength and 0.02 N/mm for GIc. This study's findings aid in predicting and mitigating failure modes in the studied chip packaging. The insights offer directions for future research, focusing on enhancing material properties and exploring the impact of manufacturing parameters and temperature conditions on delamination in multilayer semiconductors.

Tensile Strength and Mode I Fracture Toughness of Polymer Concretes Enhanced with Glass Fibers and Metal Chips.

This study experimentally investigates the influence of metal chips and glass fibers on the mode I fracture toughness, energy absorption, and tensile strength of polymer concretes (PCs) manufactured by waste aggregates. A substantial portion of the materials employed in manufacturing and enhancing the tested polymer concrete are sourced from waste material. To achieve this, semi-circular bend (SCB) samples were fabricated, both with and without a central crack, to analyze the strength and fracture behavior of the composite specimens. The specimens incorporated varying weight percentages comprising 50 wt% coarse mineral aggregate, 25 wt% fine mineral aggregate, and 25 wt% epoxy resin. Metal chips and glass fibers were introduced at 2, 4, and 8 wt% of the PC material to enhance its mechanical response. Subsequently, the specimens underwent 3-point bending tests to obtain tensile strength, mode I fracture toughness, and energy absorption up to failure. The findings revealed that adding 4% brass chips along with 4% glass fibers significantly enhanced energy absorption (by a factor of 3.8). However, using 4% glass fibers alone improved it even more (by a factor of 10.5). According to the results, glass fibers have a greater impact than brass chips. Introducing 8% glass fibers enhanced the fracture energy by 92%. However, in unfilled samples, aggregate fracture and separation hindered crack propagation, and filled samples presented added barriers, resulting in multiple-site cracking.

Development of a Unified Specimen for Adhesive Characterization-Part 2: Experimental Study on the Mode I (mDCB) and II (ELS) Fracture Components.

Adhesive bonding has been increasingly employed in multiple industrial applications. This has led to a large industrial demand for faster, simpler, and cheaper characterization methods that allow engineers to predict the mechanical behavior of an adhesive with numerical models. Currently, these characterization processes feature a wide variety of distinct standards, specimen configurations, and testing procedures and require deep knowhow of complex data-reduction schemes. By suggesting the creation of a new and integrated experimental tool for adhesive characterization, it becomes possible to address this problem in a faster and unified manner. In this work, following a previous numerical study, the mode I and II components of fracture-toughness characterization were validated experimentally in two different configurations, Balanced and Unbalanced. For mode I, it was demonstrated that both configurations presented similar numerical and experimental R-curves. The relative error against standard tests was lower than ±5% for the Balanced specimen; the Unbalanced system showed higher variations, which were predicted by the numerical results. Under mode II, the Balanced specimen displayed plastic deformation due to high deflections. On the contrary, the Unbalanced specimen did not show this effect and presented a relative error of approximately ±2%. Nonetheless, it was proven that this approach to obtain such data by using a single unified specimen is still feasible but needs further development to obtain with similar precision of standard tests. In the end, a conceptual change is proposed to solve the current mode II issues.

Mode I Fatigue and Fracture Assessment of Polyimide-Epoxy and Silicon-Epoxy Interfaces in Chip-Package Components.

Semiconductor advancements demand greater integrated circuit density, structural miniaturization, and complex material combinations, resulting in stress concentrations from property mismatches. This study investigates the failure in two types of interfaces found in chip packages: silicon-epoxy mold compound (EMC) and polyimide-EMC. These interfaces were subjected to quasi-static and fatigue loading conditions. Employing a compliance-based beam method, the tests determined interfacial critical fracture energy values, (GIC), of 0.051 N/mm and 0.037 N/mm for the silicon-EMC and polyimide-EMC interfaces, respectively. Fatigue testing on the polyimide-epoxy interface revealed a fatigue threshold strain energy, (Gth), of 0.042 N/mm. We also observed diverse failure modes and discuss potential mechanical failures in multi-layer chip packages. The findings of this study can contribute to the prediction and mitigation of failure modes in the analyzed chip packaging. The obtained threshold energy and crack growth rate provide insights for designing safe lives for bi-material interfaces in chip packaging under cyclic loads. These insights can guide future research directions, emphasizing the improvement of material properties and exploration of the influence of manufacturing parameters on delamination in multilayer semiconductors.

High hydrostatic pressure activates gene expression that leads to ethanol production enhancement in a Saccharomyces cerevisiae distillery strain.

High hydrostatic pressure (HHP) is a stress that exerts broad effects on microorganisms with characteristics similar to those of common environmental stresses. In this study, we aimed to identify genetic mechanisms that can enhance alcoholic fermentation of wild Saccharomyces cerevisiae isolated from Brazilian spirit fermentation vats. Accordingly, we performed a time course microarray analysis on a S. cerevisiae strain submitted to mild sublethal pressure treatment of 50 MPa for 30 min at room temperature, followed by incubation for 5, 10 and 15 min without pressure treatment. The obtained transcriptional profiles demonstrate the importance of post-pressurisation period on the activation of several genes related to cell recovery and stress tolerance. Based on these results, we over-expressed genes strongly induced by HHP in the same wild yeast strain and identified genes, particularly SYM1, whose over-expression results in enhanced ethanol production and stress tolerance upon fermentation. The present study validates the use of HHP as a biotechnological tool for the fermentative industries.

Effectiveness of Self-Adhesive Resin Luting Cement in CAD-CAM Blocks-A Systematic Review and Meta-Analysis.

Self-adhesive resin cements (SARCs) are used because of their mechanical properties, ease of cementation protocols, and lack of requirements for acid conditioning or adhesive systems. SARCs are generally dual-cured, photoactivated, and self-cured, with a slight increase in acidic pH, allowing self-adhesiveness and increasing resistance to hydrolysis. This systematic review assessed the adhesive strength of SARC systems luted to different substrates and computer-aided design and manufacturing (CAD/CAM) ceramic blocks. The PubMed/MedLine and Science Direct databases were searched using the Boolean formula [((dental or tooth) AND (self-adhesive) AND (luting or cement) AND CAD-CAM) NOT (endodontics or implants)]. Of the 199 articles obtained, 31 were selected for the quality assessment. Lava Ultimate (resin matrix filled with nanoceramic) and Vita Enamic (polymer-infiltrated ceramic) blocks were the most tested. Rely X Unicem 2 was the most tested resin cement, followed by Rely X Unicem > Ultimate > U200, and µTBS was the test most used. The meta-analysis confirmed the substrate-dependent adhesive strength of SARCs, with significant differences between them and between SARCs and conventional resin-based adhesive cement (α < 0.05). SARCs are promising. However, one must be aware of the differences in the adhesive strengths. An appropriate combination of materials must be considered to improve the durability and stability of restorations.

Study of Hybrid Composite Joints with Thin-Ply-Reinforced Adherends.

It has been demonstrated that a possible solution to reducing delamination in a unidirectional composite laminate lies in the replacement of conventional carbon-fibre-reinforced polymer layers with optimized thin-ply layers, thus creating hybrid laminates. This leads to an increase in the transverse tensile strength of the hybrid composite laminate. This study investigates the performance of a hybrid composite laminate reinforced by thin plies used as adherends in bonded single lap joints. Two different composites with the commercial references Texipreg HS 160 T700 and NTPT-TP415 were used as the conventional composite and thin-ply material, respectively. Three configurations were considered in this study: two reference single lap joints with a conventional composite or thin ply used as the adherends and a hybrid single lap. The joints were quasi-statically loaded and recorded with a high-speed camera, allowing for the determination of damage initiation sites. Numerical models of the joints were also created, allowing for a better understanding of the underlying failure mechanisms and the identification of the damage initiation sites. The results show a significant increase in tensile strength for the hybrid joints compared to the conventional ones as a result of changes in the damage initiation sites and the level of delamination present in the joint.

Effects of Mode Mixity and Loading Rate on Fracture Behavior of Cracked Thin-Walled 304L Stainless Steel Sheets with Large Non-Linear Plastic Deformation.

This study investigates the mixed-mode I/II fracture behavior of O-notched diagonally loaded square plate (DLSP) samples containing an edge crack within the O-notch. This investigation aims to explore the combined effects of loading rate and mode mixity on the fracture properties of steel 304L, utilizing DLSP samples. The DLSP samples, made from strain-hardening steel 304L, were tested at three different loading rates: 1, 50, and 400 mm/min, covering five mode mixities from pure mode I to pure mode II. Additionally, tensile tests were performed on dumbbell-shaped specimens at the same loading rates to examine their influence on the material's mechanical properties. The findings revealed that stress and strain diagrams derived from the dumbbell-shaped samples were largely independent of the tested loading rates (i.e., 1-400 mm/min). Furthermore, experimental results from DLSP samples showed no significant impact of the loading rates on the maximum load values, but did indicate an increase in the ultimate displacement. In contrast to the loading rate, mode mixity exhibited a notable effect on the fracture behavior of DLSP samples. Ultimately, it was observed that the loading rate had an insignificant effect on the fracture path or trajectory of the tested DLSP samples.

Effect of the Interface/Interphase on the Water Ingress Properties of Joints with PBT-GF30 and Aluminum Substrates Using Silicone Adhesive.

The aim of this work is to analyze the difference between silicone/composite and silicone/metal interphases, both in terms of water diffusion behavior and failure of the aged joints. For that, silicone joints with two different suhbstrates were prepared. The substrates were polybutylene terephthalate with 30% of short glass fiber (PBT-GF30) and 6082-T6 aluminum. It is assumed that the water uptake of the joints is equal to the water uptake of the substrate, adhesive, and interphase. Therefore, knowing the first three, the last could be isolated. To study the water diffusion behavior of the complete joint, rectangular joints were prepared, immersed in water and their water uptake was measured. The water immersion was conducted at 70 °C. It was concluded that the aluminum/silicone joints absorbed more water through the interphase region than the PBT-GF30/silicone joints, since the difference between the expected water uptake and the experimentally measured mass gain is significantly higher, causing adhesive failure of the joint. The same was not observed in the PBT-GF30/silicone, with a more stable interphase, that does not absorb measurable quantities of water and always exhibits cohesive failure.

Developments in Laminate Modification of Adhesively Bonded Composite Joints.

The use of carbon fibre reinforced polymer (CFRP) materials is increasing in many different industries, such as those operating in the aviation, marine, and automotive sectors. In these applications, composite parts are often joined with other composite or metallic parts, where adhesive bonding plays a key role. Unlike conventional joining methods, adhesive bonding does not add weight or require the drilling of holes, both of which are major sources of stress concentration. The performance of a composite joint is dependent on multiple factors and can be improved by modifying the adhesive layer or the composite layup of the adherend. Moreover, joint geometry, surface preparation, and the manufacturing methods used for production are also important factors. The present work reviews recent developments on the design and manufacture of adhesively bonded joints with composite substrates, with particular interest in adherend modification techniques. The effects of stacking sequence, use of thin-plies, composite metal laminates and its specific surface preparations, and the use of toughened surface layers in the composite adherends are described for adhesively bonded CFRP structures.

Impact Fatigue Life of Adhesively Bonded Composite-Steel Joints Enhanced with the Bi-Adhesive Technique.

One of the most common loading conditions that bonded joints experience in service is repeated impact. Despite the destructive effects of impact fatigue, the behavior of metal-composite bonded joints subjected to repeated impact loads has rarely been studied in the literature. Therefore, it is of utmost importance to pay attention to this phenomenon on the one hand and to find solutions to improve the impact fatigue life of bonded composite metal components on the other hand. Accordingly, in this study, the use of the bi-adhesive technique is proposed to improve the durability of composite-metal single-lap joints (SLJs) under impact fatigue loading conditions. J-N (energy-life) method is also used to analyze the experimental data obtained. Accordingly, in the present study, the impact fatigue behavior of single adhesive metal to composite joints was analyzed experimentally based on the J-N method and also numerically using the finite element method (FEM). By using two adhesives along a single overlap, the impact fatigue life of joints between dissimilar composite and metal joints was also analyzed experimentally. The results show that the double adhesives technique can significantly improve the impact fatigue life of the tested joints. It was also found that the optimum length ratio of the adhesives (the length covered by the ductile adhesive relative to the total overlap size) is a function of the stiffness of the joint and is more pronounced for less stiff bonded joints. A linear elastic numerical analysis was also conducted to evaluate the stress state along the bloodline of the bonded joints. Results show that the compressive peel stress made at the boundary of the two adhesives can be a possible reason behind the different results observed.

Development of a Unified Specimen for Adhesive Characterisation-Part 1: Numerical Study on the Mode I (mDCB) and II (ELS) Fracture Components.

Adhesives are increasingly being employed in industrial applications as a replacement for traditional mechanical joining methods, since they enable improvements in the strength-to-weight ratio and lower the cost of the overall structures. This has led to a need for adhesive mechanical characterisation techniques that can provide the data needed to build advanced numerical models, allowing structural designers to expedite the adhesive selection process and grant precise optimisation of bonded connection performance. However, mechanically mapping the behaviour of an adhesive involves numerous different standards resulting in a complex network of various specimens, testing procedures and data reduction methods that concern techniques which are exceedingly complex, time-consuming, and expensive. As such, and to address this problem, a novel fully integrated experimental characterisation tool is being developed to significantly reduce all the issues associated with adhesive characterisation. In this work, a numerical optimisation of the unified specimen's fracture toughness components, comprising the combined mode I (modified double cantilever beam) and II (end-loaded split) test, was performed. This was achieved by computing the desired behaviour as a function of the apparatus' and specimens' geometries, through several dimensional parameters, and by testing different adhesives, widening the range of applications of this tool. In the end, a custom data reduction scheme was deduced and set of design guidelines was defined.

Development and Study of a New Silane Based Polyurethane Hybrid Flexible Adhesive-Part 1: Mechanical Characterization.

The need for more sustainable adhesive formulations has led to the use of silane-based adhesives in different industrial sectors, such as the automotive industry. In this work, the mechanical properties of a dual cure two-component prototype adhesive which combined silylated polyurethane resin (SPUR) with standard epoxy resin was characterized under quasi-static conditions. The characterization process consisted of tensile bulk testing, to determine the Young's modulus, the tensile strength and the tensile strain to failure. The shear stiffness and shear strength were measured by performing a thick adherend shear test. The in-plane strain field was obtained using a digital image correlation method. Double-cantilever beam and mixed-mode tests were performed to assess the fracture toughness under pure modes. The prototype adhesive showed promising but lower properties compared to commercial solutions. Furthermore, the adhesive was modified via the addition of three different resin modifier additives and characterized via measuring the shear and tensile properties, but no enhancements were found. Finally, the adhesive was formulated with three different SPUR viscosities. The critical energy release rate analysis showed an optimum value for the medium viscosity SPUR adhesive.

Extended Finite Element Method (XFEM) Model for the Damage Mechanisms Present in Joints Bonded Using Adhesives Doped with Inorganic Fillers.

The use of adhesive bonding in diverse industries such as the automotive and aerospace sectors has grown considerably. In structural construction, adhesive joints provide a unique combination of low structural weight, high strength and stiffness, combined with a relatively simple and easily automated manufacturing method, characteristics that are ideal for the development of modern and highly efficient vehicles. In these applications, ensuring that the failure mode of a bonded joint is cohesive rather than adhesive is important since this failure mode is more controlled and easier to model and to predict. This work presents a numerical technique that enables the precise prediction of the bonded joint's behavior regarding not only its failure mode, but also the joint's strength, when inorganic fillers are added to the adhesive. To that end, hollow glass particles were introduced into an epoxy adhesive in different amounts, and a numerical study was carried out to simulate their influence on single lap joint specimens. The numerical results were compared against experimental ones, not only in terms of joint strength, but also their failure pattern. The neat adhesive, which showed 9% and 20% variations in terms of failure load and displacement, respectively. However, looking at the doped configurations, these presented smaller variations of about 2% and 10% for each respective variable. In all cases, by adding glass beads, crack initiation tended to change from adhesive to cohesive but with lower strength and ductility, correctly modeling the general experimental behavior as intended.

The Development and Study of a New Silylated Polyurethane-Based Flexible Adhesive-Part 2: Joint Testing and Numerical Modelling.

The need for more sustainable adhesive formulations has presented the possibility of using silane-based adhesives in the automotive industry. In this work, a dual-cure two-component silylated polyurethane resin (SPUR) adhesive was tested in single-lap joints, to assess in-joint behaviour at room temperature under quasi-static conditions for aluminium substrates. The effect of two different overlap lengths, 25 and 50 mm, was also considered. A numerical model was built using cohesive zone modelling in finite element software, to reproduce the mechanical behaviour of the joint. The model was fed with data experimentally withdrawn from the first part of this paper. A triangular-shaped cohesive zone model (CZM) law was chosen as the adhesive behaviour was highly elastic and lacked yielding phenomena. The experimental results served as the base for the numerical validation, allowing accurate CZM parameters to be successfully determined.