Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems.

Persano, Anna; Quaranta, Fabio; Taurino, Antonietta; Siciliano, Pietro Aleardo; Iannacci, Jacopo

Persano, Anna; Quaranta, Fabio; Taurino, Antonietta; Siciliano, Pietro Aleardo; Iannacci, Jacopo.

Afiliação

Persano A; IMM-CNR, Institute for Microelectronics and Microsystems, National Research Council, Via Monteroni, 73100 Lecce, Italy.
Quaranta F; IMM-CNR, Institute for Microelectronics and Microsystems, National Research Council, Via Monteroni, 73100 Lecce, Italy.
Taurino A; IMM-CNR, Institute for Microelectronics and Microsystems, National Research Council, Via Monteroni, 73100 Lecce, Italy.
Siciliano PA; IMM-CNR, Institute for Microelectronics and Microsystems, National Research Council, Via Monteroni, 73100 Lecce, Italy.
Iannacci J; CMM-FBK, Center for Materials and Microsystems, Fondazione Bruno Kessler, Via Sommarive 18, 38123 Povo - Trento, Italy.

Sensors (Basel) ; 20(7)2020 Apr 10.

Article em En | MEDLINE | ID: mdl-32290063

Palavras-chave

5G; RF MEMS; oxygen plasma etching; silicon nitride; thin film encapsulation

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Texto completo: 1 Base de dados: MEDLINE Tipo de estudo: Prognostic_studies Idioma: En Revista: Sensors (Basel) Ano de publicação: 2020 Tipo de documento: Article País de afiliação: Itália

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