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Nanomolding of Gold and Gold-Silicon Heterostructures at Room Temperature.
Raj, Arindam; Liu, Naijia; Liu, Guannan; Sohn, Sungwoo; Xiang, Junxiang; Liu, Ze; Schroers, Jan.
Afiliação
  • Raj A; Department of Mechanical Engineering and Materials Science, Yale University, New Haven, Connecticut 06511, United States.
  • Liu N; Department of Mechanical Engineering and Materials Science, Yale University, New Haven, Connecticut 06511, United States.
  • Liu G; Department of Mechanical Engineering and Materials Science, Yale University, New Haven, Connecticut 06511, United States.
  • Sohn S; Department of Mechanical Engineering and Materials Science, Yale University, New Haven, Connecticut 06511, United States.
  • Xiang J; Department of Engineering Mechanics, School of Civil Engineering, Wuhan University, 430072, Wuhan, People's Republic of China.
  • Liu Z; Department of Engineering Mechanics, School of Civil Engineering, Wuhan University, 430072, Wuhan, People's Republic of China.
  • Schroers J; Department of Mechanical Engineering and Materials Science, Yale University, New Haven, Connecticut 06511, United States.
ACS Nano ; 15(9): 14275-14284, 2021 Sep 28.
Article em En | MEDLINE | ID: mdl-34473492
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: ACS Nano Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Estados Unidos
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Base de dados: MEDLINE Idioma: En Revista: ACS Nano Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Estados Unidos