RESUMO
Effect of sandblasting of the copper electrode structures before deposition of gold thin film for micro electrical impedance tomography (EIT) system has been studied experimentally. The comparison has been performed on the unmodified copper electrodes and the sandblasted electrodes before deposition of gold layer, using structural analysis while their performance in EIT system has been measured and analyzed. The results of scanning electron microscopy and atomic force microscopy show that the sandblasting of the electrodes results in the deposition of gold film with smaller grain size and uniformly, comparing to the unmodified structure. The measurement of impedance shows that the sandblasting will increase the double layer capacitance of electrode structure which improves the impedance measurement accordingly.