RESUMO
Ni-based bimetallic films with 20 at.% and 45 at.% Cu and mesostructured surfaces were prepared by electrodeposition from an aqueous solution containing micelles of P123 triblock copolymer serving as a structure-directing agent. The pH value of the electrolytic solution had a key effect on both the resulting Cu/Ni ratio and the surface topology. The catalytic activity of the CuNi films toward hydrogen evolution reaction was investigated by cyclic voltammetry (CV) in 1 M KOH electrolyte at room temperature. The Cu45Ni55 film showed the highest activity (even higher than that of a non-mesostructured pure Ni film), which was attributed to the Ni content at the utmost surface, as demonstrated by CV studies, as well as the presence of a highly corrugated surface.