RESUMO
This study proposes a new method for measuring thermal contact resistance using lock-in thermography. By using lock-in thermography with an infrared microscope, the dynamic and spatially resolved temperature behavior of the contact interface was visualized on a microscale with one measurement. In addition, a new thermal contact resistance measurement principle was constructed after solving the three-dimensional thermal conduction equation in the cylindrical coordinates by considering a periodic heat source with a Gaussian intensity distribution and the relative position of the heating point to the sample edge, in the presence of thermal resistance at the contact interface. Consequently, the discontinuous behaviors of the temperature wave, amplitude, and phase lag at the contact interface were observed on a microscale. From that discontinuity, the local thermal contact resistance was analyzed as a fitting parameter by matching the theoretical curve to the measured amplitude and phase lag. Furthermore, the simultaneous analysis of the material thermal diffusivity was demonstrated and the validity of the measurements was confirmed.